MC10LVEP11DG ON Semiconductor, MC10LVEP11DG Datasheet - Page 7

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MC10LVEP11DG

Manufacturer Part Number
MC10LVEP11DG
Description
IC BUFFER FANOUT ECL 1:2 8SOIC
Manufacturer
ON Semiconductor
Type
Fanout Buffer (Distribution)r
Datasheet

Specifications of MC10LVEP11DG

Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
CML, LVDS, PECL
Output
ECL, PECL
Frequency - Max
3GHz
Voltage - Supply
2.375 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Frequency-max
3GHz
Number Of Outputs
4
Max Input Freq
3000 MHz (Typ)
Propagation Delay (max)
0.31 ns @ 2.375V to 3.8V
Supply Voltage (max)
- 3.8 V or 3.8 V
Supply Voltage (min)
- 2.375 V or 2.375 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC10LVEP11DGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10LVEP11DG
Manufacturer:
ON Semiconductor
Quantity:
128
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
25. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
26. Skew is measured between outputs under identical transitions.
Table 10. AC CHARACTERISTICS
f
t
t
t
t
V
t
t
Symbol
max
PLH
PHL
SKEW
JITTER
r
f
PP
,
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Frequency (Figure 2)
Propagation Delay
(Differential Configuration)
Within Device Skew
Device to Device Skew (Note 26)
CLOCK Random Jitter (RMS)
@ v1.0 GHz
@ v1.5 GHz
@ v2.0 GHz
@ v2.5 GHz
@ v3.0 GHz
Input Voltage Swing
(Differential Configuration)
Output Rise/Fall Times
(20% − 80%)
Characteristic
1000
900
800
700
600
500
400
300
200
100
0
0
CLK to Q, Q
V
CC
2.5 V
3.3 V
= 0 V; V
Q, Q
Q, Q
1000
EE
Min
Figure 2. F
170
150
70
= −3.8 V to −2.375 V or V
http://onsemi.com
FREQUENCY (MHz)
−40°C
0.126
0.112
0.112
0.155
0.111
Typ
230
800
110
5.0
3
2000
7
max
1200
Max
300
130
170
Typical
0.3
0.2
0.3
0.2
0.2
20
Min
180
150
CC
80
3000
= 2.375 V to 3.8 V; V
0.142
0.162
0.122
0.172
0.217
25°C
Typ
240
800
120
5.0
3
CC
− 2.0 V.
1200
Max
310
130
180
0.4
0.3
0.2
0.3
0.3
20
4000
EE
Min
210
150
100
= 0 V (Note 25)
0.209
0.162
0.170
0.235
0.368
85°C
Typ
270
800
140
5.0
3
1200
Max
360
150
200
0.3
0.2
0.3
0.3
0.6
20
Unit
GHz
mV
ps
ps
ps
ps

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