LM4865MX National Semiconductor, LM4865MX Datasheet - Page 11

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LM4865MX

Manufacturer Part Number
LM4865MX
Description
Manufacturer
National Semiconductor
Datasheet

Specifications of LM4865MX

Operational Class
Class-AB
Audio Amplifier Output Configuration
1-Channel Mono
Output Power (typ)
1x1@8Ohm/0.11x1@8OhmW
Audio Amplifier Function
Headphone/Speaker
Total Harmonic Distortion
0.6@8Ohm@300mW%
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Rail/rail I/o Type
No
Power Supply Rejection Ratio
50dB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM4865MX
Manufacturer:
NS/国半
Quantity:
20 000
Part Number:
LM4865MX/NOPB
Manufacturer:
NS/国半
Quantity:
20 000
Application Information
an external 1kΩ - 5kΩ resistor can be placed in parallel with
the internal 20kΩ resistor. The tradeoff for using this resistor
is increased quiescent current.
RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT
Figure 4 through Figure 6 show the recommended two-layer
PC board layout that is optimized for the SO-8 packaged
LM4865 and associated external components. Figure 7
through Figure 11 show the recommended four-layer PC
board layout for the micro SMD packaged LM4865. A
four-layer board is recommended when using the micro
SMD packaged LM4865: the two inner layers, one con-
nected to the GND pin, the other to the V
heatsinking. Both layouts are designed for use with an ex-
ternal 5V supply, 8Ω speakers, and 32Ω headphones. The
schematic for both recommended PC board layouts is Figure
1.
Both circuit boards are easy to use. Apply a 5V supply
voltage and ground to the board’s V
respectively. Connect a speaker with an 8Ω minimum imped-
ance between the board’s -OUT and +OUT pads. For head-
phone use, the layout has provisions for a headphone jack,
J1. When a jack is connected as shown, inserting a head-
phone plug automatically switches off the external speaker.
FIGURE 4. Recommended SO PC board layout:
component side silkscreen
DD
(Continued)
and GND pads,
DD
pin, provide
10102538
11
FIGURE 5. Recommended SO PC board layout:
FIGURE 6. Recommended SO PC board layout:
component side layout
bottom side layout
www.national.com
10102539
10102540

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