AD9779BSVZ Analog Devices Inc, AD9779BSVZ Datasheet - Page 8

• Manufacturer Part Number: AD9779BSVZ
• Description: IC DAC 16BIT DUAL 1GSPS 100TQFP
• Manufacturer: Analog Devices Inc

Specifications of AD9779BSVZ

• Data Interface: Serial
• Number Of Bits: 16
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 300mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Resolution (bits): 16bit
• Sampling Rate: 1GSPS
• Input Channel Type: Parallel
• Digital Ic Case Style: QFP
• No. Of Pins: 160
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9779A-EBZ - BOARD EVALUATION FOR AD9779A
• Settling Time: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9776/AD9778/AD9779
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
I
I
Aux
P1D15 to P1D0,
P2D15 to P2D0
DATACLK, TXENABLE
CLK+, CLK−
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
OUT1-P
OUT2-N
Range
2-P
, I
, Aux
, Aux
OUT1-N
1-P
2-N
, I
, Aux
OUT2-P
1-N
,
,
With
Respect
To
AGND,
DGND,
CGND
AGND,
DGND,
CGND
DGND,
CGND
AGND,
CGND
AGND,
DGND
AGND
AGND
DGND
DGND
CGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +1.98 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−1.0 V to AVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Rev. A | Page 8 of 56
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
100-lead, thermally enhanced TQFP_EP package, θ
with the bottom EPAD soldered to the PCB. With the bottom
EPAD not soldered to the PCB, θ
specifications are valid with no airflow movement.
ESD CAUTION
JA
= 27.4°C/W. These
JA
= 19.1°C/W