LM4867MTE National Semiconductor, LM4867MTE Datasheet
LM4867MTE
Specifications of LM4867MTE
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LM4867MTE Summary of contents
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... LM4867MT will deliver 1.1W into 8Ω. See the Application Information sections for further information concern- ing the LM4867LQ and the LM4867MT. Note 2: An LM4867LQ or LM4867MTE that has been properly mounted to a circuit board and forced-air cooled will deliver 2.4W into 3Ω. Connection Diagrams ...
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Connection Diagrams See NS Package Number LQA24A for Exposed-DAP LLP Typical Application * Refer to the Application Information section titled PROPER SELECTION OF EXTERNAL COMPONENTS for details concerning the value of C FIGURE 1. Typical Audio Amplifier Application Circuit (Pin ...
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... L LM4867LQ 3Ω L LM4867MTE 4Ω L LM4867LQ 4Ω L LM4867 8Ω L THD 1kHz (Note 16) LM4867MTE 3Ω L LM4867LQ 3Ω L LM4867MTE 4Ω L LM4867LQ 4Ω L LM4867 8Ω L THD kHz 32Ω 41˚C/W (Note 7) 51˚C/W (Note 8) 90˚C/W (Note 9) 42˚C/W (Note 10) ≤ T −40˚C ≤ MAX A 2.0V ≤ ...
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... Note 14: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier. Note 15: Output power is measured at the device terminals. Note 16: When driving 3Ω or 4Ω loads and operating supply, the LM4867LQ and LM4867MTE must be mounted to a circuit board that has a minimum of 2 2.5in of exposed, uniterrupted copper area connected to the LLP or TSSOP package’ ...
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... Typical Performance Characteristics MTE- and LQ- Specific Characteristics LM4867MTE THD+N vs Output Power LM4867LQ THD+N vs Output Power LM4867MTE THD+N vs Output Power 20001333 20001353 20001336 5 LM4867MTE THD+N vs Frequency 20001334 LM4867LQ THD+N vs Frequency 20001354 LM4867LQ THD+N vs Output Power 20001355 www.national.com ...
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... Power Derating Curve Note 18: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it ...
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Typical Performance Characteristics THD+N vs Frequency THD+N vs Frequency THD+N vs Output Power 20001303 THD+N vs Output Power 20001305 THD+N vs Output Power 20001307 7 THD+N vs Frequency 20001304 20001306 20001308 www.national.com ...
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Typical Performance Characteristics THD+N vs Output Power THD+N vs Output Power Output Power vs Load Resistance www.national.com (Continued) 20001365 20001366 20001362 8 THD+N vs Frequency 20001363 THD+N vs Frequency 20001364 Power Dissipation vs Supply Voltage 20001360 ...
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Typical Performance Characteristics Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Load Resistance (Continued) 20001309 20001311 20001313 9 Output Power vs Supply Voltage 20001310 Output Power vs Load Resistance 20001312 Power Dissipation vs Output Power ...
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Typical Performance Characteristics Dropout Voltage vs Supply Voltage Power Dissipation vs Output Power Channel Separation www.national.com (Continued) 20001315 20001317 20001319 10 Power Derating Curve 20001316 Noise Floor 20001318 Channel Separation 20001320 ...
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Typical Performance Characteristics Power Supply Rejection Ratio Supply Current vs Supply Voltage External Components Description Figure 1 Components 1. R Inverting input resistance which sets the closed-loop gain in conjunction with R i high pass filter with ...
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Application Information applied to both headphone speaker terminals. This results in no net DC current flow through the speaker. AC current flows through a headphone speaker as an audio signal’s output amplitude increases on the speaker’s terminal. When operating as ...
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Application Information FIGURE 4. Typical Audio Amplifier Application Circuit (Pin out shown for the 24-pin Exposed-DAP LLP package. Numbers are for the 20-pin MTE and MT packages.) STEREO-INPUT MULTIPLEXER (STEREO MUX) The LM4867 has two stereo inputs. ...
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... LM4867MTE can take advantage of forced air cooling. With an air flow rate of 450 linear-feet per minute and a 2.5in exposed copper or 5.0in the LM4867MTE can continuously drive a 3Ω load to full power. The LM4867LQ achieves the same output power level without forced-air cooling. In all circumstances and under all conditions, the junction temperature must be held below 150˚ ...
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Application Information PCB LAYOUT AND SUPPLY REGULATION CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’s impedance. As load imped- ance decreases, load dissipation ...
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Application Information JMAX DMAX Equation (6) gives the maximum junction temperature the result violates the LM4867’s 150˚C, reduce the JMAX maximum junction temperature by reducing the power sup- ply voltage or increasing the load ...
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Application Information headphones are connected to the jack shown in Figure 8, and internal pull−up forces V on the internal comparator’s DD HP−IN inputs. This changes the comparator’s output state and enables the headphone function: it turns off Amp2B, switches ...
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Application Information (Pin numbers are for the 20-pin MTE and MT packages.) INPUT CAPACITOR VALUE SELECTION Amplifying the lowest audio frequencies requires high value input coupling capacitor (C in Figure 4). A high value capaci- i tor ...
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Application Information In order eliminate “clicks and pops“, all capacitors must be discharged before turn-on. Rapidly switching V allow the capacitors to fully discharge, which may cause “clicks and pops“. NO LOAD STABILITY The LM4867 may exhibit low level oscillation ...
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Application Information www.national.com (Continued) FIGURE 9. Recommended LQ PC Board Layout: Component-Side Silkscreen FIGURE 10. Recommended LQ PC Board Layout: Component-Side Layout 20 20001340 20001341 ...
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Application Information FIGURE 11. Recommended LQ PC Board Layout: FIGURE 12. Recommended LQ PC Board Layout: (Continued) Upper Inner-Layer Layout Lower Inner-Layer Layout 21 20001342 20001343 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 13. Recommended LQ PC Board Layout: Bottom-Side Layout FIGURE 14. Recommended MTE PC Board Layout: Component-Side Silkscreen 22 20001344 20001345 ...
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Application Information FIGURE 15. Recommended MTE PC Board Layout: FIGURE 16. Recommended MTE PC Board Layout: (Continued) Component-Side Layout Upper Inner-Layer Layout 23 20001346 20001347 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 17. Recommended MTE PC Board Layout: Lower Inner-Layer Layout FIGURE 18. Recommended MTE PC Board Layout: Bottom-Side Layout 24 20001348 20001349 ...
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Application Information FIGURE 19. Recommended MT PC Board Layout: FIGURE 20. Recommended MT PC Board Layout: (Continued) Component-Side Silkscreen Component-Side Layout 25 20001350 20001351 www.national.com ...
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Application Information www.national.com (Continued) FIGURE 21. Recommended MT PC Board Layout: Bottom-Side Layout 26 20001352 ...
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Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead MOLDED PKG, Leadless Leadframe Package LLP 20-Lead MOLDED PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH Order Number LM4867LQ NS Package Number LQA24A Order Number LM4867MT NS Package Number MTC20 27 www.national.com ...
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... Tel: 1-800-272-9959 Deutsch Tel: +49 (0) 69 9508 6208 English www.national.com Français Tel: +33 ( 8790 Order Number LM4867MTE NS Package Number MXA20A 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system affect its safety or effectiveness ...