GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 142

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
2. Solderability of tin plating termination chips might be
3. When components are immersed in solvent after mounting,
Table 1
Recommended Conditions
4. Optimum Solder Amount for Reflow Soldering
124
Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
!Caution
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the component's surface (ΔT) as small as possible.
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of tin is used. Please confirm the solderability of tin
plated termination chips before use.
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
4-1. Overly thick application of solder paste results in a
4-2. Too little solder paste results in a lack of adhesive
4-3. Make sure the solder has been applied smoothly to
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued from the preceding page.
Atmosphere
GRM02/03/15/18/21/31
GJM02/03/15
LLL15/18/21/31
LLR18
GQM18/21
GRM32/43/55
LLA18/21/31
LLM21/31
GNM
GQM22
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
the end surface to a height of 0.2mm* min.
Part Number
Infrared Reflow
230 to 250°C
Air
Pb-Sn Solder
Vapor Reflow
230 to 240°C
Air
Temperature Differential
ΔTV190°C
ΔTV130°C
Lead Free Solder
240 to 260°C
Air or N
2
[Standard Conditions for Reflow Soldering]
[Allowable Reflow Soldering Temperature and Time]
Peak Temperature
Peak Temperature
Temperature (D)
Temperature (D)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
280
270
260
250
240
230
220
∗ GRM02/03: 1/3 of Chip Thickness min.
200°C
170°C
150°C
130°C
170°C
150°C
130°C
0
ΔT
ΔT
Infrared Reflow
Vapor Reflow
30
60-120 seconds 30-60 seconds
60-120 seconds
Preheating
Preheating
60
Continued on the following page.
Soldering
20 seconds max.
Soldering
Soldering Time (sec.)
90
Gradual
Cooling
Gradual
Cooling
Time
Time
0.2mm ∗ min.
in section
120
C02E.pdf
Oct.1,2012