GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 211

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
5. Flow Soldering
Table 2
Recommended Conditions
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Peak Temperature
Optimum Solder Amount for Flow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. Additionally, an excessively long
soldering time or high soldering temperature results in
leaching by the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in Table 2. It is required
to keep temperature differential between the soldering
and the components surface (ΔT) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively large, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
Atmosphere
G--18/21/31
Part Number
Pb-Sn Solder
240-250°C
Air
Temperature Differential
ΔTV150D
Lead Free Solder
250-260°C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
Peak Temperature
Temperature (D)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
270
260
250
240
230
170°C
150°C
130°C
0
Adhesive
ΔT
10
60-120 seconds
Preheating
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
!Caution
Gradual
Cooling
Time
in section
193
C02E.pdf
Oct.1,2012