PIC10F200-I/P Microchip Technology, PIC10F200-I/P Datasheet - Page 85

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PIC10F200-I/P

Manufacturer Part Number
PIC10F200-I/P
Description
IC PIC MCU FLASH 256X12 8DIP
Manufacturer
Microchip Technology
Series
PIC® 10Fr

Specifications of PIC10F200-I/P

Program Memory Type
FLASH
Program Memory Size
384B (256 x 12)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
3
Ram Size
16 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC10F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
16 B
Interface Type
USB
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
4
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINAC164037 - MODULE SKT 6L PROMATE II SOT23
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC10F200-I/P
Manufacturer:
MICROCHIP
Quantity:
1 200
Part Number:
PIC10F200-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
6-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
LASER MARK
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIN 1 ID BY
Number of Pins
Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
A1
A
N
1
e
2
D
e1
4
3
Dimension Limits
b
E1
PIC10F200/202/204/206
Units
A2
A1
E1
e1
L1
A2
N
A
E
D
e
L
φ
c
b
E
c
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0.08
0.20
MIN
MILLIMETERS
0.95 BSC
1.90 BSC
NOM
Microchip Technology Drawing C04-028B
6
MAX
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
0.26
0.51
30°
L1
L
DS41239D-page 83
φ

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