PIC10F200-I/P Microchip Technology, PIC10F200-I/P Datasheet - Page 94

• Manufacturer Part Number: PIC10F200-I/P
• Description: IC PIC MCU FLASH 256X12 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F200-I/P

• Program Memory Type: FLASH
• Program Memory Size: 384B (256 x 12)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINAC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC10F200/202/204/206
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at [phone].
Please list the following information, and use this outline to provide us with your comments about this document.
DS41239D-page 92
To:
RE:
From: Name
Application (optional):
Would you like a reply?
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
Technical Publications Manager
Reader Response
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
PIC10F200/202/204/206
Y
N
Literature Number:
DS41239D
FAX: (______) _________ - _________
Total Pages Sent ________
© 2007 Microchip Technology Inc.