CY7C63801-PXC Cypress Semiconductor Corp, CY7C63801-PXC Datasheet - Page 76

• Manufacturer Part Number: CY7C63801-PXC
• Description: IC USB PERIPHERAL CTRLR 16-DIP
• Manufacturer: Cypress Semiconductor Corp
• Series: CY7Cr

Specifications of CY7C63801-PXC

• Controller Type: USB Peripheral Controller
• Interface: USB
• Voltage - Supply: 4 V ~ 5.5 V
• Current - Supply: 40mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Package Type: MDIP
• Mounting: Through Hole
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 770-1001 - ISP 4PORT CYPRESS ENCORE II MCUCY4623 - KIT MOUSE REFERENCE DESIGN428-1774 - EXTENSION KIT FOR ENCORE II428-1773 - KIT DEVELOPMENT ENCORE II
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

29. Ordering Information
30. Package Handling
Some IC packages require baking before they are soldered onto a PCB to remove moisture that may have been absorbed after leaving
the factory. A label on the packaging has details about actual bake temperature and the minimum bake time to remove this moisture.
The maximum bake time is the aggregate time that the parts are exposed to the bake temperature. Exceeding this exposure time may
degrade device reliability.
Document 38-08035 Rev. *N
CY
CY7C63310-SXC
CY7C63801-SXC
CY7C63803-SXC
CY7C63803-SXCT
CY7C63813-PXC
CY7C63813-SXC
CY7C63823-QXC
CY7C63823-SXC
CY7C63823-SXCT
CY7C63803-LQXC
CY7C63823-XC
CY7C63823-3XW14C
CY7C63833-LTXC
CY7C63833-LTXCT
29.1 Ordering Code Definitions
T
T
BAKETEMP
BAKETIME
Parameter
7
C XXXXX XX X CT
Ordering Code
Bake temperature
Bake time
Description
FLASH Size
3K
4K
8K
8K
8K
8K
8K
8K
8K
8K
8K
8K
8K
8K
See package label
Temperature Grade: C = Commercial, I = Industrial
Pb-free
Package Type
Family
Technology: CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Min
–
RAM Size
128
256
256
256
256
256
256
256
256
256
256
256
256
256
18-PDIP
24-QFN Sawn
Die form
32-QFN Sawn
32-QFN Sawn, Tape and Reel
16-SOIC
16-SOIC
16-SOIC
16-SOIC, Tape and Reel
18-SOIC
24-QSOP
24-SOIC
24-SOIC, Tape and Reel
Wafer form
Typical
125
–
CY7C63310, CY7C638xx
Package Type
See package label
Max
72
Page 76 of 86
hours
Unit
°C
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