AXH010A0D93-SRZ Lineage Power, AXH010A0D93-SRZ Datasheet - Page 14

• Manufacturer Part Number: AXH010A0D93-SRZ
• Description: DC/DC Converters & Regulators 3.0-5.5V 2.0Vout 10A SMT Remote Sense
• Manufacturer: Lineage Power

Specifications of AXH010A0D93-SRZ

• Product: Non-Isolated / POL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: CC109151437

Data Sheet
October 1, 2009
Surface Mount Information
MSL Rating
The Austin Lynx
Storage and Handling
The recommended storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of £ 30°C and 60% relative humidity varies accord-
ing to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Figure 31. Recommended linear reflow profile using Sn/
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Lineage Power
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Ag/Cu solder.
TM
SMT modules have a MSL rating of 1.
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
(continued)
Austin Lynx
Cooling
Zone
3.0 Vdc - 5.5 Vdc Input, 0.9 Vdc - 3.3 Vdc Output, 10 A
TM
SMT Non-Isolated dc-dc Power Modules:
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