PIC10F200-I/P Microchip Technology Inc., PIC10F200-I/P Datasheet - Page 65

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PIC10F200-I/P

Manufacturer Part Number
PIC10F200-I/P
Description
8 PIN, 384 B FLASH, 16 RAM, 4 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC10F200-I/P

Cpu Speed
1 MIPS
Eeprom Memory
0 Bytes
Frequency
4 MHz
Input Output
4
Memory Type
Flash
Number Of Bits
8
Package Type
8-pin PDIP
Programmable Memory
375 Bytes
Ram Size
16 Bytes
Speed
4 MHz
Timers
1-8-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC10F200-I/P
Manufacturer:
MICROCHIP
Quantity:
1 200
Part Number:
PIC10F200-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
12.0
Absolute Maximum Ratings
Ambient temperature under bias.......................................................................................................... -40°C to +125°C
Storage temperature ............................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Max. current out of V
Max. current into V
Input clamp current, I
Output clamp current, I
Max. output current sunk by any I/O pin .............................................................................................................. 25 mA
Max. output current sourced by any I/O pin ......................................................................................................... 25 mA
Max. output current sourced by I/O port .............................................................................................................. 75 mA
Max. output current sunk by I/O port ................................................................................................................... 75 mA
© 2006 Microchip Technology Inc.
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: P
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
DD
with respect to V
DD
SS
IK
pin ..................................................................................................................................... 80 mA
(1)
OK
(V
pin .................................................................................................................................. 80 mA
.................................................................................................................................. 800 mW
I
(V
< 0 or V
O
< 0 or V
SS
I
SS
............................................................................................................... 0 to +6.5V
> V
(†)
..........................................................................................................0 to +13.5V
O
DD
> V
SS
)
DD
............................................................................... -0.3V to (V
)
Preliminary
DIS
PIC10F200/202/204/206
= V
DD
x {I
DD
– ∑ I
OH
} + ∑ {(V
DD
– V
OH
) x I
OH
DS41239C-page 63
} + ∑(V
DD
+ 0.3V)
OL
20 mA
20 mA
x I
OL
)

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