CL21B105KOFNNNG SAMSUNG, CL21B105KOFNNNG Datasheet - Page 17

• Manufacturer Part Number: CL21B105KOFNNNG
• Manufacturer: SAMSUNG

● STORAGE CONDITION
▶ Storage Environment
▶ Corrosive Gases
▶ Temperature Fluctuations
● DESIGN OF LAND PATTERN
When designing printed circuit boards, the shape and size of the lands must allow for the proper
amount of solder on the capacitor.
The amount of solder at the end terminations has a direct effect on the crack.
The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount
of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently.
Use the following illustrations as guidelines for proper land design.
Recommendation of Land Shape and Size.
S o ld er
L a n d
Guaranteed storage period is within 6 months from the outgoing date of delivery.
The electrical characteristics of MLCCs were degraded by the environment of high temperature or
humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity
of less than 40℃ and 70%, respectively.
Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere
such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.
out of storage, it is important to maintain the temperature-controlled environment
Since dew condensation may occur by the differences in temperature when the MLCCs are taken
2/3 W < b < W
W
S o ld er R e sist
b
a
T
2/3 T < a < T
S o ld er R e sist
.