4-1926733-6 TE Connectivity, 4-1926733-6 Datasheet - Page 8

High Speed / Modular Connectors 25S 16P R/A RECPT SOCKET/RECPT CONTACT

4-1926733-6

Manufacturer Part Number
4-1926733-6
Description
High Speed / Modular Connectors 25S 16P R/A RECPT SOCKET/RECPT CONTACT
Manufacturer
TE Connectivity
Datasheets

Specifications of 4-1926733-6

Pcb Mount Alignment
Without
Pcb Mount Retention
With
Pcb Mounting Orientation
Right Angle
Make First / Break Last
Yes
Product Line
MINIPAK HDL
Ul File Number
E28476
Termination Method To Pc Board
Through Hole - Press Fit
Sealed
No
Number Of Power Positions
16
Operating Voltage Reference
AC
Operating Voltage (vac)
250
Hot Pluggable
No
Tail Length (mm [in])
3.3 [0.13]
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
8.00 [0.315]
Number Of Signal Positions
25
Number Of Positions
41
Pcb Mount Retention Type
Screw Mount
Selectively Loaded
Yes
Centerline (mm [in])
2.00 [0.079]
Centerline, Power Contacts (mm [in])
2.75 [0.108]
Underplate Material Thickness (µm [?in])
1.27 [50.000]
Length (x-axis) (mm [in])
68.21 [2.690]
Width (z-axis) (mm [in])
36.58 [1.440]
Number Of Rows
1
Mating Retention
Without
Tail Plating Material
Bright Tin-Lead
Contact Type
Socket
Contact Base Material
Copper
Contact Plating, Mating Area, Material
Gold or Palladium Nickel or Performance Based
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Tail Plating, Thickness (µm [?in])
0.5 [20]
Underplate Material
Nickel
Contact Design
Single Beam
Connector Style
Receptacle
Mating Alignment
With
Housing Material
Crystal Polymer
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Mating Alignment Type
Passive Guide
Connector Contact Configuration (no. Of Pos./type)
25/Signal, 16/AC Power
Custom Configurable
No
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Agency/standard
UL, CSA
Ul Rating
Recognized
Ul Voltage Rating (vac)
250
Csa Certified
Yes
Operating Temperature (°c [°f])
-40 – +125 [-40 – +257]
Pcb Thickness, Recommended (mm [in])
1.40 [0.055]
Applies To
Printed Circuit Board
Board-to-board Configuration
Co-Planar
Contact Transmits (typical Application)
Signal (Data)/ Power
Application Use
Board-to-Board
Pick And Place Cover
Without
Packaging Method
Tray
Lead Free Status / Rohs Status
 Details
4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specim ens resubm itted for qualification. Testing to
confirm corrective action is required before resubm ittal.
Quality Conform ance Inspection
The applicable quality inspection plan shall specify the sam pling acceptable quality level to be used.
Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing
and this specification.
Specim en Selection
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test groups 1, 3, 4, 8 and 10 shall each consist of 5
m ated plugs and receptacles. Test group 2 shall consist of 15 m ated plugs and receptacles: 5
plugs fully loaded with power and signal contacts; 5 with power contacts only; and 5 with signal
contacts only. Test Group 5 shall consist of 3 m ated plugs and receptacles. Test Groups 6 and 11
shall each consist of 5 plugs. Test Groups 7 and 9 shall each consist of 5 receptacles.
Test Sequence
Qualification inspection shall be verified by testing specim ens as specified in Figure 2.
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