UJA1069TW24/3V0,51 NXP Semiconductors, UJA1069TW24/3V0,51 Datasheet - Page 62

• Manufacturer Part Number: UJA1069TW24/3V0,51
• Description: IC LIN FAIL-SAFE 24-HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1069TW24/3V0,51

• Applications: Automotive
• Interface: LIN (Local Interconnect Network)
• Voltage - Supply: 3V
• Package / Case: 24-TSSOP Exposed Pad, 24-eTSSOP, 24-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935280016518; UJA1069TW24/3V0-T; UJA1069TW24/3V0-T

NXP Semiconductors
14. Revision history
Table 29.
UJA1069_3
Product data sheet
Document ID
UJA1069_3
Modifications:
UJA1069_2
UJA1069_1
Revision history
Release date
20070910
20070305
20051222
•
•
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
The symbols LWEN and ERREM have been removed from
Changes have been made to some values in
Fig 29. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
Data sheet status
Product data sheet
Preliminary data sheet
Objective data sheet
Rev. 03 — 10 September 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Table
Change notice
-
-
-
5,
Table 11
Table 20
LIN fail-safe system basis chip
and
Table
and
temperature
peak
Table 21
22.
Supersedes
UJA1069_2
UJA1069_1
-
UJA1069
© NXP B.V. 2007. All rights reserved.
001aac844
respectively.
time
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