CY7C1312AV18-133BZC Cypress Semiconductor Corp, CY7C1312AV18-133BZC Datasheet

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CY7C1312AV18-133BZC

Manufacturer Part Number
CY7C1312AV18-133BZC
Description
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1312AV18-133BZC

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Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1312AV18-133BZC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Cypress Semiconductor Corporation
Document #: 38-05497 Rev. *A
Features
Configurations
CY7C1310AV18 – 2M x 8
CY7C1312AV18 – 1M x 18
CY7C1314AV18 – 512K x 36
Logic Block Diagram (CY7C1310AV18)
• Separate independent Read and Write data ports
• 167-MHz clock for high bandwidth
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
• Two input clocks (K and K) for precise DDR timing
• Two output clocks (C and C) account for clock skew
• Echo clocks (CQ and CQ) simplify data capture in high
• Single multiplexed address input bus latches address
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x18, and x36 configurations
• Full data coherancy , providing most current data
• Core Vdd=1.8V(+/-0.1V);I/O Vddq=1.4V to Vdd
• 13 x 15 x 1.4 mm 1.0-mm pitch FBGA package, 165 ball
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
— Supports concurrent transactions
Write ports (data transferred at 333 MHz) @ 167MHz
— SRAM uses rising edges only
and flight time mismatching
speed systems
inputs for both Read and Write ports
(11x15 matrix)
A
(19:0)
WPS
BWS
V
DOFF
REF
K
K
20
[1:0]
D
[7:0]
18-Mb QDR™-II SRAM 2-Word Burst Architecture
Register
Address
Control
Logic
8
CLK
Gen.
3901 North First Street
PRELIMINARY
Write
Reg
Read Data Reg.
Functional Description
The CY7C1310AV18/CY7C1312AV18/CY7C1314AV18 are
1.8V Synchronous Pipelined SRAMs, equipped with QDR-II
architecture. QDR-II architecture consists of two separate
ports to access the memory array. The Read port has
dedicated Data Outputs to support Read operations and the
Write Port has dedicated Data Inputs to support Write opera-
tions. QDR-II architecture has separate data inputs and data
outputs to completely eliminate the need to “turn-around” the
data bus required with common I/O devices. Access to each
port is accomplished through a common address bus. The
Read address is latched on the rising edge of the K clock and
the Write address is latched on the rising edge of the K clock.
Accesses to the QDR-II Read and Write ports are completely
independent of one another. In order to maximize data
throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with two 8-bit words (CY7C1310AV18) or 18-bit
words (CY7C1312AV18) or 36-bit words (CY7C1314AV18)
that burst sequentially into or out of the device. Since data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K and C and C), memory bandwidth
is maximized while simplifying system design by eliminating
bus “turn-arounds.”
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
16
Write
Reg
8
8
San Jose
Reg.
Reg.
Register
Address
,
Control
Logic
CA 95134
Reg.
8
Revised June 1, 2004
CY7C1310AV18
CY7C1312AV18
CY7C1314AV18
8
20
C
C
RPS
8
408-943-2600
A
(19:0)
Q
[7:0]
CQ
CQ

Related parts for CY7C1312AV18-133BZC

CY7C1312AV18-133BZC Summary of contents

Page 1

... Read and Write ports are equipped with Double Data Rate (DDR) interfaces. Each address location is associated with two 8-bit words (CY7C1310AV18) or 18-bit words (CY7C1312AV18) or 36-bit words (CY7C1314AV18) that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge ...

Page 2

... Logic Block Diagram (CY7C1312AV18) D [17:0] 18 Address Register A (18: CLK K Gen. DOFF V REF WPS Control Logic BWS [1:0] Logic Block Diagram (CY7C1314AV18) D [35:0] 36 Address Register A (17: CLK K Gen. DOFF V REF WPS Control Logic BWS [3:0] Selection Guide Maximum Operating Frequency Maximum Operating Current Document #: 38-05497 Rev ...

Page 3

... Q17 R TDO TCK A Document #: 38-05497 Rev. *A PRELIMINARY CY7C1310AV18 (2M × 8) – 11 × 15 BGA NC/144M BWS WPS NC/288M K BWS VSS DDQ DDQ DDQ DDQ DDQ DDQ DDQ CY7C1312AV18 (1M × 18) – 11 × 15 BGA NC/288M WPS BWS BWS DDQ DDQ DDQ DDQ DDQ DDQ DDQ ...

Page 4

... Read and Write operations. Internally, the device is organized arrays each for CY7C1310AV18 arrays each of 512K x 18) for CY7C1312AV18 and 512K arrays each of 256K x 36) for CY7C1314AV18. Therefore, only 20 address inputs are needed to access the entire memory array of CY7C1310AV18, 19 address inputs for CY7C1312AV18 and 18 address inputs for CY7C1314AV18 ...

Page 5

... K and K when in single clock mode. When the Read port is deselected, Q are automatically tri-stated. [x:0] CY7C1310AV18 − Q [7:0] CY7C1312AV18 − Q [17:0] CY7C1314AV18 − Q [35:0] Read Port Select, active LOW. Sampled on the rising edge of Positive Input Clock (K). When active, a Read operation is initiated. Deasserting will cause the Read port to be deselected ...

Page 6

... Single Clock Mode The CY7C1312AV18 can be used with a single clock that controls both the input and output registers. In this mode, the device will recognize only a single pair of input clocks (K and K) that control both the input and output registers. This operation is identical to the operation if the device had zero skew between the K/K and C/C clocks ...

Page 7

... Depth Expansion The CY7C1312AV18 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). Each port select input can deselect the specified port. Deselecting a port will not affect the other port. All pending transactions (Read and Write) will be completed prior to the device being deselected ...

Page 8

... During the Data portion of a Write sequence : H L L-H – CY7C1310AV18 − only the upper nibble (D CY7C1312AV18 − only the upper byte (D L-H During the Data portion of a Write sequence : H L – CY7C1310AV18 − only the upper nibble (D CY7C1312AV18 − only the upper byte (D ...

Page 9

... CYC IL (Max – 0.2V. IL REF (min.) within 200ms. During this time V < (Max.) = 0.95V or 0.54V , whichever is smaller. REF DDQ CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Ambient [14] Temperature 1.8 ± 0.1 V 0°C to +70°C 1. Min. Typ. Max. 1.7 1 ...

Page 10

... Test conditions follow standard test methods and procedures for measuring thermal impedence, per EIA / JESD51. /I and load capacitance shown in ( test loads and t less than t . CLZ CHZ CO CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 167 MHz 133 MHz Min. Max. Min. Max. 6.0 7.9 7.5 2.4 – 3.0 2.4 – ...

Page 11

... Document #: 38-05497 Rev. *A PRELIMINARY Test Conditions T = 25° MHz 1. 1.5V DDQ V = 0.75V REF V 0.75V R = 50Ω REF OUTPUT Device 0.25V 5 pF Under ZQ Test RQ = 250Ω INCLUDING JIG AND (b) SCOPE CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Max. Unit [12] ALL INPUT PULSES 1.25V 0.75V Slew Rate = Page ...

Page 12

... In this example , if address A2=A1,then data Q20=D10 and Q21=D11. Write data is forwarded immediately as read results. This note applies to the whole diagram., Document #: 38-05497 Rev. *A PRELIMINARY WRITE READ WRITE CYC t KHKH D31 D50 D51 D60 Q00 Q01 Q20 t DOH t DOH CYC t CCQO t CQOH t CCQO CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 NOP WRITE NOP D61 t HD Q21 Q40 Q41 t CHZ t CQD DON’T CARE UNDEFINED Page ...

Page 13

... It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Page ...

Page 14

... Q-bus pins. Note that this bit is pre-set HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the "Test-Logic-Reset" state. Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Page ...

Page 15

... IDLE Note: 24. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05497 Rev. *A PRELIMINARY [24] SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT-DR 1 EXIT1-DR 0 PAUSE- EXIT2-DR 1 UPDATE- CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 1 SELECT IR-SCAN 0 1 CAPTURE- SHIFT- EXIT1- PAUSE- EXIT2-IR 1 UPDATE- Page ...

Page 16

... Boundary Scan Register TAP Controller [9,12,25] Over the Operating Range Test Conditions = −2 −100 µ 2 100 µ GND ≤ V ≤ CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 0 Selection Circuitry Min. Max. 1.4 1.6 0.4 0.2 0.65V –0.3 0.35V DD −5 5 Page TDO Unit ...

Page 17

... CS CH 27. Test conditions are specified using the load in TAP AC test conditions. t Document #: 38-05497 Rev. *A PRELIMINARY [26, 27] Over the Operating Range Description [27] 1. TMSS t TMSH t TDIS t TDIH t TDOV / ns CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 Min. Max. Unit 100 ns 10 MHz ALL INPUT PULSES 0.9V ...

Page 18

... Bit Size 107 Description Boundary Scan Order Bump ID Bit # 11P 10P 10N 9P 10M 11N CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 CY7C1314AV18 512K x 36 Description 000 Version number. 00000110100 Allows unique identification of SRAM vendor. 1 Indicates the presence register. (continued) Bump 11L 18 11M 10L 21 ...

Page 19

... Boundary Scan Order (continued) Bit # Document #: 38-05497 Rev. *A PRELIMINARY Boundary Scan Order Bump ID Bit # 11F 11G 9F 10F 11E 10E 10D 9E 10C 11D 9C 9D 11B 11C 9B 10B 11A Internal 100 5B 101 5A 102 4A 103 5C 104 4B 105 3A 106 CY7C1310AV18 CY7C1312AV18 CY7C1314AV18 (continued) Bump Page ...

Page 20

... CY7C1312AV18-167BZC CY7C1314AV18-167BZC 133 CY7C1310AV18-133BZC CY7C1312AV18-133BZC CY7C1314AV18-133BZC Package Diagram QDR SRAMs and Quad Data Rate SRAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC and Samsung technology. All product and company names mentioned in this document are the trademarks of their respective holders. ...

Page 21

... Document History Page Document Title: CY7C1310AV18/CY7C1312AV18/CY7C1314AV18 18-Mb QDR™-II SRAM 2-Word Burst Architecture Document Number: 38-05497 REV. ECN No. Issue Date ** 208405 see ECN *A 230396 see ECN Document #: 38-05497 Rev. *A PRELIMINARY Orig. of Change Description of Change DIM New Data Sheet VBL Upload datasheet to the internet ...

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