CY7C1355B-133AC Cypress Semiconductor Corp, CY7C1355B-133AC Datasheet - Page 28

• Manufacturer Part Number: CY7C1355B-133AC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1355B-133AC

• Density: 9Mb
• Access Time (max): 6.5ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 133MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 18b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 1
• Supply Current: 250mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.63V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 256K
• Lead Free Status / Rohs Status: Not Compliant

Document #: 38-05117 Rev. *C
Ordering Information
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
Speed
(MHz)
100
CY7C1355B-117BZC
CY7C1357B-117BZC
CY7C1355B-117BZI
CY7C1357B-117BZI
CY7C1355B-100AC
CY7C1357B-100AC
CY7C1355B-100AI
CY7C1357B-100AI
CY7C1355B-100BGC
CY7C1357B-100BGC
CY7C1355B-100BGI
CY7C1357B-100BGI
CY7C1355B-100BZC
CY7C1357B-100BZC
CY7C1355B-100BZI
CY7C1357B-100BZI
Ordering Code
(continued)
Package
BB165A
BB165A
BB165A
BB165A
BG119
BG119
Name
A101
A101
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
119-ball (14 x 22 x 2.4 mm) BGA 3 Chip Enables and
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables and JTAG
Part and Package Type
CY7C1355B
CY7C1357B
Commercial
Commercial
Commercial
Commercial
Page 28 of 32
Operating
Industrial
Industrial
Industrial
Industrial
Range
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