LM4880MX National Semiconductor, LM4880MX Datasheet - Page 13

• Manufacturer Part Number: LM4880MX
• Manufacturer: National Semiconductor

Specifications of LM4880MX

• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Output Power (typ): 0.325x2@8OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.03%%
• Single Supply Voltage (typ): 3/5V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 50dB
• Single Supply Voltage (min): 2.7V
• Single Supply Voltage (max): 5.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Dc: 0342
• Lead Free Status / Rohs Status: Not Compliant

Application Information
LM4880 MDA MWA
DUAL 250 MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE
SIGNAL NAME
BYPASS
GND
NC
GND
SHUTDOWN
INPUT B
OUTPUT B
VDD
GND
OUTPUT A
INPUT A
NC
NC
Physical Die Identification
Die Step
Wafer Diameter
Dise Size (Drawn)
Thickness
Min Pitch
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
PAD# NUMBER
Fabrication Attributes
Physical Attributes
10
11
12
13
1
2
3
4
5
6
7
8
9
(Referenced to die center, coordinates in µm) NC = No Connection
Die Bond Pad Coordinate Locations (B - Step)
(Continued)
-322
-359
-359
-359
-323
-109
-109
358
358
359
323
X/Y COORDINATES
X
8
8
LM4880B
B
150mm
952µm x 1283µm
37mils x 51mils
254µm Nominal
117µm Nominal
Die/Wafer Characteristics
Die Layout (B - Step)
13
-259
-523
-523
-523
523
259
141
406
523
523
523
-78
Y
5
Bond Pad Opening Size (min)
Bond Pad Metalization
Passivation
Back Side Metal
Back Side Connection
01234337
86
86
86
86
86
86
86
86
86
86
86
86
86
X
General Die Information
PAD SIZE
x
x
x
x
x
x
x
x
x
x
x
x
x
86µm x 86µm
ALUMINUM
NITRIDE
Bare Back
GND
www.national.com
188
188
188
188
86
86
86
86
86
86
86
86
86
Y