LM4782TA/NOPB National Semiconductor, LM4782TA/NOPB Datasheet
LM4782TA/NOPB
Specifications of LM4782TA/NOPB
*LM4782TA/NOPB
LM4782TA
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LM4782TA/NOPB Summary of contents
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... Typical Application FIGURE 1. Typical Audio Amplifier Application Circuit SPiKe ™ Protection and Overture ™ are trademarks of National Semiconductor Corporation. © 2006 National Semiconductor Corporation Audio Power Amplifier Series Key Specifications j Output Power/Channel with 0.5% THD+N, 1kHz into 8Ω ...
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Connection Diagrams www.national.com Plastic Package (Note 14) 200811D1 Top View Order Number LM4782TA See NS Package Number TA27A TO-220 Top Marking Top View U - Wafer Fab Code Z - Assembly Plant Code XY - Date Code TT - Die ...
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... Absolute Maximum Ratings 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications Supply Voltage | (No Signal Supply Voltage | (Input Signal) Common Mode Input Voltage Differential Input Voltage (Note 13) Output Current Power Dissipation (Note 3) ...
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Electrical Characteristics The following specifications apply for V 25˚C. Symbol Parameter CMRR Common Mode Rejection Ratio (Note 15) A Open Loop Voltage Gain VOL GBWP Gain Bandwidth Product e Input Noise IN SNR Signal-to-Noise Ratio Standby V Standby Low Input ...
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Bridged Amplifier Application Circuit FIGURE 2. Bridged Amplifier Application Circuit 5 200811D3 www.national.com ...
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Parallel Amplifier Application Circuit www.national.com FIGURE 3. Parallel Amplifier Application Circuit 6 200811D4 ...
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Single Supply Application Circuit FIGURE 4. Single Supply Amplifier Application Circuit Note: *Optional components dependent upon specific design requirements. Auxiliary Amplifier Application Circuit FIGURE 5. Special Audio Amplifier Application Circuit 200811D5 200811D6 7 www.national.com ...
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External Components Description (Figures 1-5) Components 1 R Prevents current from entering the amplifier’s non-inverting input. This current may pass through to the load B during system power down, because of the amplifier’s low input impedance when the undervoltage circuitry ...
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Optional External Component Interaction Although the optional external components have specific desired functions that are designed to reduce the bandwidth and eliminate unwanted high frequency oscillations they may cause certain undesirable effects when they interact. Inter- action may occur for ...
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Typical Performance Characteristics THD+N vs Frequency ± 19V & 15W/Channel OUT R = 4Ω, 80kHz BW L THD+N vs Frequency ± 25V & 15W/Channel OUT R = 8Ω, 80kHz BW L THD+N vs Output ...
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Typical Performance Characteristics Output Power/Channel vs Supply Voltage f = 1kHz 4Ω, 80kHz BW L Output Power/Channel vs Supply Voltage f = 1kHz 8Ω, 80kHz BW L Total Power Dissipation vs Output Power/Channel 1% THD (max), ...
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Typical Performance Characteristics Crosstalk vs Frequency ± 19V 10W, Channel 1 OUT R = 4Ω, 80kHz BW L Crosstalk vs Frequency ± 19V 10W, Channel 3 OUT R = 4Ω, 80kHz BW L Crosstalk vs Frequency ...
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Typical Performance Characteristics Crosstalk vs Frequency ± 25V 10W, Channel 3 OUT R = 8Ω, 80kHz BW L Mute Attenuation vs Mute Pin Voltage P = 10W/Channel OUT Frequency Response of Demo Board P = 10W/Channel = 0dB, ...
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Typical Performance Characteristics Large Signal Response Common-Mode Rejection Ratio Clipping Voltage vs Supply Voltage www.national.com (Continued) 20081101 Frequency Response 20081103 20081105 14 Power Supply Rejection Ratio 20081102 Open Loop 20081104 Clipping Voltage vs Supply Voltage 20081110 ...
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Typical Performance Characteristics Clipping Voltage vs Supply Voltage THD+N vs Frequency ± 25V & 30W, Chs 1 & OUT Parallel Mode (Note 18 4Ω, 80kHz BW L THD+N vs Output Power ± 19V, ...
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Typical Performance Characteristics THD+N vs Output Power ± 22V, All Chs in Parallel Mode (Note 18 2Ω, 80kHz BW L Output Power vs Supply Voltage Chs 1 & Parallel Mode (Note 18 1kHz, R ...
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Application Information MUTE MODE By placing a logic-high voltage on the mute pins, the signal going into the amplifiers will be muted. If the mute pins are connected to a logic-low voltage, the amplifiers will non-muted state. ...
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Application Information tance, θ , (heat sink to ambient) in ˚C/W for a heat sink can SA be calculated. This calculation is made using Equation 4 which is derived by solving for θ in Equation 3. SA θ = [(T ...
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Application Information amplifier than the equivalent impedance on the two amplifi- ers in parallel will reduce total IC package power dissipation reducing the heat sink size requirement. BI-AMP AND TRI-AMP APPLICATIONS Bi-amping is the practice of using two different amplifiers ...
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Application Information PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components is required to meet the design targets of an application. The choice of external component values that will affect gain and low frequency response are discussed below. The ...
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Application Information reduced by increasing the size of the bypass capacitor near the IC. With at least a 20µF local bypass, these voltage surges are important only if the lead length exceeds a couple > feet ( 1µH lead inductance). ...
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Application Information LAYOUT, GROUND LOOPS AND STABILITY The LM4782 is designed to be stable when operated at a closed-loop gain greater, but as with any other high-current amplifier, the LM4782 can be made to oscillate under certain ...
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Application Information If the DC blocking input capacitor ( used as shown, the IN lower -3dB point is found using Equation (8) as discussed in the Proper Selection of External Components section. FIGURE 7. Inverting Amplifier Application Circuit ...
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Application Information www.national.com (Continued) FIGURE 8. Reference PCB Schematic 24 200811D8 ...
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Application Information LM4782 REFERENCE BOARD ARTWORK Composite Layer Top Layer (Continued) 200811E1 200811E0 25 200811E2 Silk Layer 200811E3 Bottom Layer www.national.com ...
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Application Information Bill Of Materials For Reference PCB Symbol Value 33kΩ IN1 IN2 IN3 1kΩ 20kΩ ...
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... BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. ...