MAX97002EWP+T Maxim Integrated Products, MAX97002EWP+T Datasheet - Page 35

• Manufacturer Part Number: MAX97002EWP+T
• Description: IC AUDIO SUBSYSTEM 20WLP
• Manufacturer: Maxim Integrated Products
• Series: DirectDrive™r
• Type: Class Dr

Specifications of MAX97002EWP+T

• Output Type: 1-Channel (Mono) with Stereo Headphones
• Max Output Power X Channels @ Load: 920mW x 1 @ 8 Ohm; 37mW x 2 @ 16 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Differential Inputs, I²C, Mute, Shutdown, Volume Control
• Mounting Type: Surface Mount
• Package / Case: 20-WLP
• Product: Class-D
• Output Power: 700 mW
• Available Set Gain: 12 dB
• Common Mode Rejection Ratio (min): 32 dB to 55 dB
• Thd Plus Noise: 0.05 %
• Operating Supply Voltage: 2.7 V to 5.5 V
• Supply Current: 0.32 mA to 1.85 mA
• Maximum Power Dissipation: 1040 mW
• Maximum Operating Temperature: + 80 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 41.2 KOhms
• Input Signal Type: Differential or Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MAX97002EWP+T

Bypass PVDD to GND with as little trace length as pos-
sible. Connect OUTP and OUTN to the speaker using
the shortest and widest traces possible. Reducing trace
length minimizes radiated EMI. Route OUTP/OUTN as
a differential pair on the PCB to minimize the loop area,
thereby reducing the inductance of the circuit. If filter
components are used on the speaker outputs, be sure
to locate them as close as possible to the MAX97002
to ensure maximum effectiveness. Minimize the trace
length from any ground tied passive components to
GND to further minimize radiated EMI.
An evaluation kit (EV kit) is available to provide an
example layout for the MAX97002. The EV kit allows
quick setup of the MAX97002 and includes easy-to-use
software, allowing all internal registers to be controlled.
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and the recommended reflow temper-
ature profile, as well as the latest information on reliability
testing results, refer to the Application Note 1891: Wafer-
Level Packaging (WLP) and Its Applications on Maxim’s
website at www.maxim-ic.com/ucsp. See Figure 15 for
the recommended PCB footprint for the MAX97002.
Speaker and Class H Headphone Amplifiers
WLP Applications Information
Audio Subsystem with Mono Class D
Figure 15. Recommended PCB Footprint
0.25mm
0.22mm
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