LMV1032UP-25/NOPB National Semiconductor, LMV1032UP-25/NOPB Datasheet - Page 10

• Manufacturer Part Number: LMV1032UP-25/NOPB
• Description: IC AMP AUDIO MONO AB MIC 4USMD
• Manufacturer: National Semiconductor
• Type: Class ABr

Specifications of LMV1032UP-25/NOPB

• Output Type: 1-Channel (Mono)
• Voltage - Supply: 1.7 V ~ 5 V
• Features: Microphone
• Mounting Type: Surface Mount
• Package / Case: 4-MicroSMD
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Audio Amplifier Function: Microphone
• Total Harmonic Distortion: 0.35%
• Single Supply Voltage (typ): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Supply Current (max): 0.085@5VmA
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 65dB
• Single Supply Voltage (min): 1.7V
• Single Supply Voltage (max): 5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 4
• Package Type: uSMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: LMV1032UP-25; LMV1032UP-25TR

Physical Dimensions
inches (millimeters)
unless otherwise noted
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. NO JEDEC REGISTRATION AS OF MAY 2005.
4-Bump Ultra Thin micro SMD with Large Dome Bump Technology
NS Package Number URA04JJA
±
±
±
X1 = 1.179
0.030 mm X2 = 1.179
0.030 mm X3 = 0.35
0.075 mm
www.national.com
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