LM4830N

Manufacturer Part NumberLM4830N
DescriptionIC AMP AUDIO PWR 2W MONO 24DIP
ManufacturerNational Semiconductor
TypeClass AB
LM4830N datasheet
 


Specifications of LM4830N

Output Type1-Channel (Mono) with Mono HeadphonesMax Output Power X Channels @ Load2W x 1 @ 4 Ohm; 100mW x 1 @ 32 Ohm
Voltage - Supply2.7 V ~ 5.5 VFeaturesMicrophone, Shutdown, Thermal Protection, Volume Control
Mounting TypeThrough HolePackage / Case24-DIP (0.600", 15.24mm)
Lead Free Status / RoHS StatusContains lead / RoHS non-compliantOther names*LM4830N
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LM4830
Two-Way Audio Amplification System
with Volume Control
General Description
The LM4830 is an integrated solution for two-way audio am-
plification. It contains a bridge-connected audio power ampli-
fier capable of delivering 1W of continuous average power to
an 8
load with less than 1% THD from a 5V power supply.
It also has the capability of driving 100 mW into a
single-ended 32
impedance for headset operation. There
is a 30 dB attenuator in front of a bridged power amplifier
with 6 dB of gain. The attenuation is controlled through 4 bits
of parallel digital control; 15 steps of 2 dB each.
The device also contains a microphone preamp with two se-
lectable inputs. Mic2 is selected when HS is high and A1 is in
single-ended mode. Mic1 is selected when HS is low and A1
is in bridged mode. This configuration is optimum for switch-
ing between an internal system speaker and external head-
set with microphone. The device also incorporates a buffer
used for driving capacitive loads.
The LM4830 also provides a low-current consumption shut-
down mode making it optimally suited for low-power portable
systems. In addition, the device has an internal thermal shut-
down protection mechanism.
Connection Diagram
© 2000 National Semiconductor Corporation
Key Specifications
n THD at 1W cont. avg P
n Instantaneous peak output power: 1.4W
n Shutdown current: 0.5 µA (typ)
n Supply voltage range: 2.7V
Features
n 4-bit digital control for 30 dB of volume attenuation
n Two selectable microphone inputs
n High performance microphone preamp
n Extra buffer for driving long cables
n No bootstrap capacitors or snubber circuits are
necessary
n Small Outline (SO) packaging
n Thermal shutdown protection circuitry
Applications
n Hands-free phone systems
n Mobile phone accessories
n Desktop conference phones
n Portable computers
n Teleconference computer applications
Dual-In-Line and
Small Outline Packages
DS012677-2
Top View
Order Number LM4830M
See NS Package Number M24B for SO
Order Number LM4830N
See NS Package Number N24A for DIP
DS012677
January 1999
into 8 :
1% (max)
O
V
5.5V
DD
www.national.com

LM4830N Summary of contents

  • Page 1

    ... Mobile phone accessories n Desktop conference phones n Portable computers n Teleconference computer applications Dual-In-Line and Small Outline Packages DS012677-2 Top View Order Number LM4830M See NS Package Number M24B for SO Order Number LM4830N See NS Package Number N24A for DIP DS012677 January 1999 into (max 5.5V DD ...

  • Page 2

    Typical Application www.national.com FIGURE 1. Typical Application Circuit 2 DS012677-1 ...

  • Page 3

    ... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 3) ESD Susceptibility (Note 4) ESD Susceptibility (Note 5) Junction Temperature Soldering Information Small Outline Package Vapor Phase (60 sec ...

  • Page 4

    Electrical Characteristics The following specifications apply for V Symbol Parameter PREAMP, A2 Xtalk Crosstalk PSRR Power Supply Rejection Ratio MICROPHONE BUFFER Buffer Input Resistance IN V Output Offset Voltage OS e Input Noise IN THD Total Harmonic Distortion ...

  • Page 5

    Computer Application Circuit FIGURE 2. 5 DS012677-4 www.national.com ...

  • Page 6

    Typical Performance Characteristics Output Power vs Supply Voltage DS012677-5 Output Power vs Supply Voltage DS012677-8 THD + N vs Output Power DS012677-11 THD + N vs Output Power DS012677-14 www.national.com (Power Amp-Bridged) Wideband Noise Floor DS012677-6 Output Power vs Supply ...

  • Page 7

    Typical Performance Characteristics THD + N vs Output Power DS012677-17 THD + N vs Output Power DS012677-20 THD + N vs Output Power DS012677-23 THD + N vs Output Power DS012677-26 (Power Amp-Bridged) (Continued) THD + N vs Output Power ...

  • Page 8

    Typical Performance Characteristics THD + N vs Output Power DS012677-29 Wideband Noise Floor DS012677-32 Output Attenuation in Shutdown Mode DS012677-35 Supply Current vs Supply Voltage DS012677-38 www.national.com (Power Amp-Bridged) (Continued) Power Amp Crosstalk to Preamp and Buffer DS012677-30 Wideband Noise ...

  • Page 9

    Application Information POWER AMPLIFIER HANDSFREE MODE As shown in Figure 1 , amplifier A1 can be used in one of two modes, bridged output or single-ended output. This IC was intended to be used in systems requiring both internal speaker ...

  • Page 10

    Application Information ground return lines should not be tied together with AC input reference ground return lines. In addition, the layout of these ground lines should be physically located as far as reason- ably possible from each other so that ...

  • Page 11

    Application Information This feature is especially useful when the IC is used in por- table battery operated systems where energy conservation is imperative. In many applications, a microcontroller or microprocessor output interfaces to the LM4830 shutdown pin, providing a quick, ...

  • Page 12

    ... Physical Dimensions 24-Lead (0.300" Wide) Molded Small Outline Package, JEDEC 24-Lead (0.600" Wide) Molded Dual-In-Line Package www.national.com inches (millimeters) unless otherwise noted Order Number LM4830M NS Package Number M24B Order Number LM4830N NS Package Number N24A 12 ...

  • Page 13

    ... NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant ...