PAH50S48-2.5 TDK Corporation, PAH50S48-2.5 Datasheet - Page 45

• Manufacturer Part Number: PAH50S48-2.5
• Manufacturer: TDK Corporation

（1） The power module is fixed to printed circuit board by
（2） The M3 mounting tapped holes of the power module
（3） Mounting Holes on Printed Circuit Board
（4）Recommended Printed Circuit Board is a double sided
（5） The standard power module lead length is 5.08mm.
・All specifications are subject to change without notice.
PAH
1 Circuit Board Mounting
2 Recommended Soldering Condition
Recommended soldering temperature is as follows.
(1) Soldering dip :
(2) Soldering iron :
3 Recommended Cleaning Condition
Recommended cleaning condition after soldering is as fol-
lows.
●Cleaning solvent :
●Cleaning Procedure :
Note : For other cleaning methods, contact us.
Pre-heat condition :
4 positions through the M3 tapped holes in the resin
case side. Recommended torque is 5.5kgcm.
are connected to the baseplate. FG (Frame Ground)
can be taken by these tapped holes.
Input/Signal/Output Terminal Pin (φ1.0mm)
glass epoxy (t=1.6mm) with through holes.
M3 Mounting Tap (FG)
Fig.1-1 Mounting method for standard model
50S48
Output terminal Pin (φ2.0 mm )
Hole Diameter
Land Diameter
Hole Diameter
Land Diameter
Hole Diameter
Land Diameter
〜
200S48
260℃ within 10 seconds
110℃ 30〜40 seconds
350℃ within 3 seconds
IPA (isopropyl alcohol)
Use brush and dry the solvent
completely
: φ1.5 mm
: φ3.5 mm
: φ2.5 mm
: φ5.0 mm
: φ3.5 mm
: φ7.0 mm
M3 Screw
Spring Washer
Plain Washer
Sikicone grease
M3 Threaded
Power Module
Printed Circuit Board
Plain Washer
Spring Washer
M3 Screw
Heatsink
M3 Threaded
Mounting Hole
Heatsink
Sikicone grease
φ3.4 Non-shreaded
Power Module
Printed Circuit Board
Plain Washer
Spring Washer
M3 Screw
3. Mounting Direction
Mounting Hole
Mounting Hole
4 Heatsink Installation
1) The power module is fixed to the heatsink by 4 posi-
2) Recommended hole diameter for heatsink = 3.5mm.
3) Use thermal grease or thermal sheet in between heat-
4) Recommended thermal sheet is as shown below. Cut-
5 Output Derating
(i) PAH50S48, PAH75S48, PAH100S48 & PAH150S48
(ii) PAH200S48
4-φ3.5
tion through the M3 mounting tapped holes provided on
the baseplate. It is recommended that the sequence to
screw the 4 screws is in a diagonally manner and the
recommended torque is 5.5kgcm.
sink and baseplate to minimize the contact thermal
resistance. However, make sure that the thermal grease
or sheet is evenly applied and using no-warped heatsink
in order to avoid any warpage on the baseplate.
ting the corner of thermal sheet is NOT advisable.
4.8
120
100
120
100
80
60
40
20
80
60
40
20
0
0
-40
-40
57.9
48.3
OK
OK
-20
Baseplate Temperature （ ℃）
-20
Baseplate Temperature （ ℃）
0
0
Temperature Measuring
Point of Baseplate
20
20
THERMAL PAD
NG
NG
60
60
80
80
100
100
NG
NG
120
120
B-187
CC-E
CE-
09XX
CE-
10XX
CE-
3101
KS
KWS
KWD
PAE
PAF
PAH
PAQ
PF-A
PFE
PH
PMH
ア
プ
リ
ケ
ー
シ
ョ
ン
ノ
ー
ト
パ
ワ
ー
モ
ジ
ュ
ー
ル