PAH50S48-2.5 TDK Corporation, PAH50S48-2.5 Datasheet - Page 81

• Manufacturer Part Number: PAH50S48-2.5
• Manufacturer: TDK Corporation

（1） Mounting hole on PCB
・All specifications are subject to change without notice.
PAH
Therefore, measurement of PCB temperature is rec-
2 Mounting Method
Verify following items before concluding power module
damage.
1） No output voltage
2） Output voltage is high.
● Is specified input voltage applied?
● Are the ON/OFF control terminal (CNT terminal),
● For cases where output voltage adjustment is used,
● Are there no abnormalities in the output load used?
● Is the ambient temperature within the specified tem-
● Are the remote sensing terminals (+S, -S) correctly
● Is the measurement done at the sensing points?
● For cases where output voltage adjustment is used,
terminals are exposed, when connecting thermo-
couple, please take sufficient insulation from termi-
nals. Over Thermal Protection of power module is
achieved by detecting the PCB temperature through
thermal sensor. When the module operates over the
output derating curve of PCB temperature, Over
Thermal Protection (OTP) functions and output shut-
down.
ommended to ensure the module to operate within the
derating curve.
Diameter of hole and land of PCB with referring be-
low.
remote sensing terminal (+S,-S), output voltage trim-
ming terminal (TRM) correctly connected?
is the resistor or variable resistor setting, connections
correctly done?
perature derating curve?
connected?
is the resistor or volume setting, connections cor-
rectly done?
Fig.1-6 Output Derating by PCB Temperature
200H
100
80
60
40
20
0
-40
3. Before concluding power module damage
Fig.1-5 Thermal Sensor Position
Thermal sensor
-20
0
PCB Temperature (℃)
20
Top
view
40
60
80
95
100
For position of the holes, see outline drawing of the
power module.
(2) Output Terminal Pin
(3) Output Pattern Width
3 Recommended Soldering Method
(1) Soldering dip
(2) Soldering iron
4 Recommended Cleaning Condition
Recommended cleaning condition after soldering is as fol-
lows.
● Cleaning solvent
IPA (isopropyl alcohol)
● Cleaning Procedure
Use brush and dry the solvent completely.
Note) For other cleaning methods, contact us.
3） Output voltage is low
4） Load regulation and line regulation is large
5） Output ripple voltage is large
● Is specified input voltage applied?
● Are the remote sensing terminals (+S, -S) correctly
● Is the measurement done at the sensing points?
● For cases where output voltage adjustment is used,
● Are there no abnormalities in the output load used?
● Is specified input voltage applied?
● Are the input terminals and the output terminals firmly
● Is the measurement done at the sensing points?
● Is the input or output wire too thin?
● Is the measuring method used the same or equivalent
● Is the input ripple voltage value within the specified
Connect +V, -V terminal pins such that the contact
resistance becomes minimal. Note that large contact
resistance could result into reduction of efficiency and
abnormal temperature rise at terminal connections
Large output current flows through the output pattern.
If pattern is too narrow, voltage drop will occur and
heat on pattern will increase. Relationship of current
and the pattern width varies depending on materials
of printed circuit board, conductor width, maximum
allowable temperature rise of the pattern etc.. Con-
firmation on manufactures of printed circuit board is
definitely necessary for designing.
260ºC within 6 seconds
Pre-heat condition
110ºC 30 - 40 seconds
350ºC within 3 seconds
connected?
is the resistor or variable resistor setting, connections
correctly done?
connected?
with the specified method in the Application Notes?
value?
Type
Input Terminal Pin
Hole Diameter
Land Diameter
Output Terminal Pin
Hole Diameter
Land Diameter
Signal Terminal Pin
Hole Diameter
Land Diameter
PAH200H48
φ 1.0mm
φ 1.5mm
φ 3.0mm
φ 2.0mm
φ 2.5mm
φ 4.5mm
φ 1.0mm
φ 1.5mm
φ 3.0mm
B-223
PAH