MSM7533V Oki Semiconductor, MSM7533V Datasheet
MSM7533V
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MSM7533V Summary of contents
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... DIP (DIP20-P-300-2.54-S1) (Product name : MSM7533HRS) 24-pin plastic SOP (SOP24-P-430-1.27-K) This version: Aug. 1998 MSM7533H/7533V/7534 Previous version: Nov. 1996 74 mW Max Max 0.3 mW Max (Product name : MSM7533VRS) (Product name : MSM7534RS) (Product name : MSM7533HGS-K) (Product name : MSM7533VGS-K) (Product name : MSM7534GS-K) 1/18 ...
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Semiconductor BLOCK DIAGRAM AIN1 – RC LPF + GSX1 AIN2 – LPF GSX2 5th – LPF AOUT1 + 5th – LPF AOUT2 + SG SGC GEN 8th AD BPF CONV. 8th BPF AUTO ZERO S&H DA CONV. ...
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... AOUT1 3 18 PDN 4 17 CHPS RSYNC 8 13 DIN2 9 12 DIN1 10 11 20-Pin Plastic Skinny DIP * The ALAW pin is only applied to the MSM7533VRS/MSM7533VGS-K. AIN2 SGC 1 AOUT2 2 GSX2 NC 3 AOUT1 4 GSX1 PDN 5 AIN1 CHPS (ALAW RSYNC ...
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Semiconductor PIN AND FUNCTIONAL DESCRIPTIONS AIN1, AIN2, GSX1, GSX2 AIN1 and AIN2 are the transmit analog inputs for channels 1 and 2. GSX1 and GSX2 are the transmit level adjustments for channels 1 and 2. AIN1 and AIN2 are ...
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Semiconductor V DD Power supply for + power supply for an analog circuit of the system which the device is applied should be used. A bypass capacitor of 0 with excellent high frequency ...
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Semiconductor RSYNC Receive synchronizing signal input. The eight bits PCM data required are selected from serial PCM signals on the DIN1 and DIN2 pins by the receive synchronizing signal. Signals in the receive section are synchronized by this synchronizing ...
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Semiconductor DOUT1 PCM signal output of channel 1 when the parallel mode is selected. The PCM output signal is output from MSD in a sequential order, synchronizing with the rising edge of the BCLK signal. MSD may be output ...
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... ALAW Control signal input of the companding law selection. Provides only for the MSM7533VRS/MSM7533VGS-K. The CODEC will operate in the m-law when this pin logic "0" level and the CODEC will operate in the A-law when this pin logic "1" level. The CODEC operates in the m-law if the pin is left open, since this pin is internally pulled down ...
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Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Analog Input Voltage Digital Input Voltage Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Analog Input Voltage Digital Input High Voltage Digital Input Low Voltage Clock Frequency Sync ...
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Semiconductor ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics Parameter Power Supply Current Input High Voltage Input Low Voltage High Level Input Leakage Current Low Level Input Leakage Current Digital Output Low Voltage Digital Output Leakage Current Input Capacitance Transmit ...
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Semiconductor AC Characteristics Parameter Transmit Frequency Response Receive Frequency Response Transmit Signal to Distortion Ratio Receive Signal to Distortion Ratio Transmit Gain Tracking Receive Gain Tracking *1 Psophometric filter is used Freq. Level Symbol Condition (Hz) (dBm0) Loss T1 ...
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Semiconductor AC Characteristics (Continued) Parameter Idle Channel Noise Absolute Level (Initial Difference) Absolute Level (Deviation of Temperature and Power) Absolute Delay Transmit Group Delay Receive Group Delay Crosstalk Attenuation *1 Psophometric filter is used *2 Upper is specified for ...
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Semiconductor AC Characteristics (Continued) Parameter Discrimination Out-of-band Spurious Intermodulation Distortion Power Supply Noise Rejection Ratio Digital Output Delay Time *6 The measurement under idle channel noise Freq. Level Symbol Condition (Hz) (dBm0) 4.6 kHz DIS 0 ...
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Semiconductor TIMING DIAGRAM Transmit Timing BCLK XSYNC DOUT1 XD1 SD DOUT2 MSD Receive Timing BCLK RSYNC t WS DIN1 MSD ...
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Semiconductor APPLICATION CIRCUIT Example of Basic Connection (PCM Serial Mode Operation) CH1 Analog Input CH1 Analog Output CH2 Analog Input CH2 Analog Output Example of Interface to the Echo ...
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Semiconductor RECOMMENDATIONS FOR ACTUAL DESIGN • To assure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for the power supply and keep them as close as possible to the device pins. • Connect the AG pin ...
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Semiconductor PACKAGE DIMENSIONS DIP20-P-300-2.54-S1 MSM7533H/7533V/7534 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating more Solder plate thickness Package weight (g) 1.49 TYP. 17/18 ...
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Semiconductor SOP24-P-430-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed ...