MSC1157MS-K Oki Semiconductor, MSC1157MS-K Datasheet
MSC1157MS-K
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MSC1157MS-K Summary of contents
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... Low current dissipation Operating current • Standby function • High output current • Differential outputs • Adjustable gain • Package options: 8-pin plastic DIP (DIP8-P-300-2.54) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name : MSC1157MS-K) Chip BLOCK DIAGRAM STBY SEL ...
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Semiconductor PIN CONFIGURATION (TOP VIEW GND PIN DESCRIPTIONS Pin Symbol Type 5 V — Power supply pin GND — Ground pin Signal input pin for analog signal inputs, etc. IN ...
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Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Maximum Output Current Power Dissipation Junction Temperature Storage Temperature *1 Avoid shorting the output pins (SP and SP RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Load Impedance ...
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Semiconductor ELECTRICAL CHARACTERISTICS Parameter A Input Resistance IN Voltage Gain Output Power Total Harmonic Distortion Ripple Elimination Ratio Output DC Voltage (*4) Output Offset Voltage Output "H" Voltage Output "L" Voltage STBY, SEL Input Current VR Equivalent Resistance Circuit ...
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Semiconductor APPLICATION CIRCUIT Standby Select Input Standby Input Audio Input • If parasitic capacitance of 60pF or more exists between GND and the speaker output pin SP or SP, oscillation may occur. Implement the circuit mount design so as ...
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Semiconductor GAIN ADJUSTMENT 1. Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components) Standby Select Input Standby Input C1 Audio Input • Cutoff frequency fc on the low frequency side is determined from the ...
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Semiconductor OPERATING CHARACTERISTICS Power Dissipation vs. Ambient Temperature 800 700 600 500 DIP SOP 400 300 200 100 0 -30 -20 - 100 Ambient Temperature Ta [°C] Power Dissipation ...
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Semiconductor Circuit Current vs. Voltage Supply 2E-3 1.5E-3 1E-3 5E Supply Voltage V [V] CC Output Voltage vs. Load Current 2 SP Output 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0 ...
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Semiconductor 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 -40 - -40 -20 Circuit Current during Standby vs. Ambient Temperature (V 3 2.6 2.2 1.8 1.4 1 0.6 0.2 -0.2 ...
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Semiconductor 10 V =3V CC RL=16W 100 10 V =3V CC RL=16W 100 Voltage Gain vs. Frequency 100 1k ...
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Semiconductor PAD CONFIGURATION Pad Layout Chip size : X=2.3mm, Y=2.4mm Chip thickness : 350 30mm Pad size (PV aperture) : 110¥110mm Substrate potential : GND Pad location diagram 2 3 Pad Coordinates (Chip center is located at X=0 and ...
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Semiconductor PACKAGE DIMENSIONS DIP8-P-300-2.54 MSC1157 (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating more Solder plate thickness Package weight (g) 0.46 TYP. 12/13 ...
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Semiconductor SOP8-P-250-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and ...
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NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application ...