ADUC812 Analog Devices, ADUC812 Datasheet - Page 6

• Manufacturer Part Number: ADUC812
• Description: Precision Analog Microcontroller: 1.3MIPS 8052 MCU + 8kB Flash + 8-Ch 12-Bit ADC + Dual 12-Bit DAC
• Manufacturer: Analog Devices

Specifications of ADUC812

• Mcu Core: 8052
• Mcu Speed (mips): 1.3
• Sram (bytes): 256Bytes
• Gpio Pins: 34
• Adc # Channels: 8

ADuC812
ABSOLUTE MAXIMUM RATINGS*
(T
AV
AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
DV
Digital Input Voltage to DGND . . . –0.3 V to DV
Digital Output Voltage to DGND . . –0.3 V to DV
V
Analog Inputs to AGND . . . . . . . . . . –0.3 V to AV
Operating Temperature Range Industrial (B Version)
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADuC812 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REF
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
A
P1.1/ADC1/T2EX
DD
= 25°C, unless otherwise noted.)
DD
P1.5/ADC5/SS
P1.0/ADC0/T2
to AGND . . . . . . . . . . . . . . . . . –0.3 V to AV
P1.2/ADC2
P1.3/ADC3
P1.4/ADC4
P1.6/ADC6
to DV
to DGND, AV
AGND
DAC0
DAC1
AV
C
V
REF
REF
DD
DD
10
12
13
11
Model
ADuC812BS
ADuC812BS
EVAL-ADuC812QS
EVAL-ADuC812QSP
1
2
3
4
5
6
7
8
9
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
52 51 50 49 48
14 15 16 17 18 19 20 21 22 23 24 25 26
PIN 1
IDENTIFIER
DD
52-Lead MQFP
to AGND . . . . . . . . . –0.3 V to +7 V
(Not to Scale)
ADuC812
TOP VIEW
47 46 45 44
43 42 41 40
Temperature
Range
–40°C to +85°C
–40°C to +85°C
39
38
37
36
35
34
33
32
31
30
29
28
27
P2.7/A15/A23
P2.6/A14/A22
P2.5/A13/A21
P2.4/A12/A20
DGND
DV
XTAL2
XTAL1
P2.3/A11/A19
P2.2/A10/A18
P2.1/A9/A17
P2.0/A8/A16
SDATA/MOSI
DD
DD
DD
DD
PIN CONFIGURATIONS
DD
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Package
Description
52-Lead Metric Quad Flat Package
56-Lead Lead Frame Chip Scale Package
QuickStart Development System
QuickStart Development System Plus
–6–
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
θ
Lead Temperature, Soldering
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
P1.1/ADC1/ T2EX
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
P1.5/ADC5/ SS
P1.2/ADC2
P1.3/ADC3
P1.4/ADC4
AV DD
AV DD
AGND
AGND
AGND
DAC0
DAC1
C REF
V REF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
INDENTIFIER
PIN 1
56-Lead LFCSP
ADuC812
(Not to Scale)
TOP VIEW
Package
Option
S-52
CP-56
42
41
40
39
38
37
36
35
34
33
32
31
30
29
P2.7/A15/A23
P2.6/A14/A22
P2.5/A13/A21
P2.4/A12/A20
DGND
DGND
DV DD
XTAL2
XTAL1
P2.3/A11/A19
P2.2/A10/A18
P2.1/A9/A17
P2.0/A8/A16
SDATA/ MOSI
REV. E