ADP1755 Analog Devices, ADP1755 Datasheet - Page 6

• Manufacturer Part Number: ADP1755
• Description: 1.2A Low-Vin, Adjustable-Vout LDO Linear Regulator
• Manufacturer: Analog Devices

ADP1754/ADP1755
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Table 5. Pin Function Descriptions
ADP1754
Pin No.
1, 2, 3, 15,
16
4
5
6
7
8
9
N/A
10, 11, 12,
13, 14
17 (EPAD)
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD ON THE BOTTOM OF THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND
INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED PAD
BE CONNECTED TO THE GROUND PLANE ON THE BOARD.
ADP1755
Pin No.
1, 2, 3, 15,
16
4
5
6
7
8
N/A
9
10, 11, 12,
13, 14
17 (EPAD)
VIN
VIN
VIN
EN
Figure 3. ADP1754 Pin Configuration
1
2
3
4
(Not to Scale)
ADP1754
TOP VIEW
PIN 1
INDICATOR
Mnemonic
VIN
EN
PG
GND
SS
NC
SENSE
ADJ
VOUT
Exposed
paddle
(EPAD)
12 VOUT
11 VOUT
10 VOUT
9 SENSE
Description
Regulator Input Supply. Bypass VIN to GND with a 4.7 μF or greater capacitor. Note that all five
VIN pins must be connected to the source.
Enable Input. Drive EN high to turn on the regulator; drive it low to turn off the regulator. For
automatic startup, connect EN to VIN.
Power Good. This open-drain output requires an external pull-up resistor to VIN. If the part is in
shutdown mode, current-limit mode, thermal shutdown, or if it falls below 90% of the nominal
output voltage, PG immediately transitions low.
Ground.
Soft Start. A capacitor connected to this pin determines the soft start time.
Not Connected. No internal connection.
Sense. This pin measures the actual output voltage at the load and feeds it to the error
amplifier. Connect SENSE as close as possible to the load to minimize the effect of IR drop
between the regulator output and the load.
Adjust. A resistor divider from VOUT to ADJ sets the output voltage.
Regulated Output Voltage. Bypass VOUT to GND with a 4.7 μF or greater capacitor. Note that all
five VOUT pins must be connected to the load.
The exposed pad on the bottom of the LFCSP package enhances thermal performance and is
electrically connected to GND inside the package. It is recommended that the exposed pad be
connected to the ground plane on the board.
Rev. B | Page 6 of 20
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD ON THE BOTTOM OF THE LFCSP ENHANCES
THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND
INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED PAD
BE CONNECTED TO THE GROUND PLANE ON THE BOARD.
VIN
VIN
VIN
EN
Figure 4. ADP1755 Pin Configuration
1
2
3
4
(Not to Scale)
ADP1755
TOP VIEW
PIN 1
INDICATOR
12 VOUT
11 VOUT
10 VOUT
9 ADJ