LMC6762AIN National Semiconductor, LMC6762AIN Datasheet - Page 4

• Manufacturer Part Number: LMC6762AIN
• Description: IC COMP DUAL MICRPWR CMOS 8-DIP
• Manufacturer: National Semiconductor
• Type: General Purposer

Specifications of LMC6762AIN

• Number Of Elements: 2
• Output Type: Push-Pull, Rail-to-Rail
• Voltage - Supply: 2.7 V ~ 15 V, ±1.35 V ~ 7.5 V
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: *LMC6762AIN

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t
t
t
t
RISE
FALL
PHL
PLH
Symbol
AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
the temperature extreme.
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the electrical characteristics.
Note 2: Human body model, 1.5 kΩ in series with 100 pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C. Output currents in excess of
Note 4: The maximum power dissipation is a function of T
P
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Do not short circuit output to V
Note 8: Input Offset Voltage Average Drift is calculated by dividing the accelerated operating life drift average by the equivalent operational time. The Input Offset
Voltage Average Drift represents the input offset voltage change at worst-case input conditions.
Note 9: C
Note 10: The rise and fall times are measured with a 2V input step. The propagation delays are also measured with a 2V input step.
D
= (T
J(max)
L
Rise Time
Fall Time
Propagation Delay
(High to Low)
Propagation Delay
(Low to High)
includes the probe and jig capacitance.
– T
A
Parameter
)/θ
JA
.All numbers apply for packages soldered directly into a PC board.
+
f = 10 kHz, C
Overdrive = 10 mV (Notes 9, 10)
f = 10 kHz, C
Overdrive = 10 mV (Notes 9, 10)
f = 10 kHz,
C
(Notes 9, 10)
V
f = 10 kHz,
C
(Notes 9, 10)
f = 10 kHz,
C
(Notes 9, 10)
V
f = 10 kHz,
C
(Notes 9, 10)
, when V
+
+
L
L
L
L
= 50 pF
= 2.7V,
= 50 pF
= 50 pF
= 2.7V,
= 50 pF
+
is greater than 12V or reliability will be adversely affected.
L
L
= 50 pF,
= 50 pF,
Conditions
J(max)
, θ
Overdrive = 10 mV
Overdrive = 100 mV
Overdrive = 10 mV
Overdrive = 100 mV
Overdrive = 10 mV
Overdrive = 100 mV
Overdrive = 10 mV
Overdrive = 100 mV
J
= 25˚C, V
JA
, and T
±
4
30 mA over long term may adversely affect reliability.
A
. The maximum allowable power dissipation at any ambient temperature is
+
= 5V, V
−
= 0V, V
(Note 5)
Typ
0.3
0.3
10
10
4
4
6
4
7
4
CM
= V
O
LMC6762AI
= V
(Note 6)
Limit
+
/2. Boldface limits apply at
LMC6762BI
(Note 6)
Limit
Units
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs