NL27WZ125USG ON Semiconductor, NL27WZ125USG Datasheet - Page 2

• Manufacturer Part Number: NL27WZ125USG
• Description: IC BUFFER DL TRI-ST NON-INV US8
• Manufacturer: ON Semiconductor
• Series: 27WZr

Specifications of NL27WZ125USG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: US8, 8-VSSOP
• Package: 8US
• Logic Family: LCX
• Logic Function: Buffer/Line Driver
• Number Of Outputs Per Chip: 2
• Output Type: 3-State
• Input Signal Type: Single-Ended
• Maximum Propagation Delay Time @ Maximum Cl: 5.7@3.3V|5@5V ns
• Polarity: Non-Inverting
• Number Of Channels Per Chip: Dual
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Input Bias Current (max): 1 uA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 250 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 3
• Propagation Delay Time: 5.7 ns @ 3.3 V or 5 ns @ 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NL27WZ125USGOS; NL27WZ125USGOS; NL27WZ125USGOSTR

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
RECOMMENDED OPERATING CONDITIONS
DEVICE ORDERING INFORMATION
MAXIMUM RATINGS
Specifications Brochure, BRD8011/D.
NL27WZ125US
NL27WZ125USG
Symbol
Symbol
Dt/DV
V
T
I
MSL
V
V
I
I
GND
q
Device Order
V
V
P
F
I
STG
T
T
ESD
T
V
OK
I
CC
V
CC
IK
JA
CC
O
O
R
O
A
L
J
D
I
I
Number
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Power Dissipation in Still Air at 85°C
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Supply Voltage
Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
Indicator
Circuit
Logic
NL
NL
Gates per
Package
No. of
2
2
Device Nomenclature
Identifier
Range
Parameter
Parameter
Temp
7
7
http://onsemi.com
Technology
WZ
WZ
Output in High Impedance State
Charged Device Model (Note 4)
Output in HIGH or LOW State
Human Body Model (Note 2)
2
Machine Model (Note 3)
Oxygen Index: 28 to 34
Function
(HIGH or LOW State)
Device
Data Retention Only
V
V
V
125
125
CC
CC
CC
= 2.5 V $0.2 V
= 3.0 V $0.3 V
= 5.0 V $0.5 V
Package
V
Operating
V
Suffix
O
I
(Note 5)
(Note 1)
US
US
< GND
< GND
(Pb−Free)
Package
Type
US8
US8
UL 94 V−0 @ 0.125 in
1.65
Min
−55
1.5
−0.5 to V
0
0
0
0
0
*0.5 to )7.0
*0.5 to )7.0
*0.5 to )7.0
*65 to )150
Level 1
> 2000
Value
$100
$100
)150
> 200
*50
*50
$50
260
250
250
N/A
CC
178 mm, 3000 Unit
178 mm, 3000 Unit
+ 0.5
+125
Max
Reel Size
5.5
5.5
5.5
5.5
Tape and
20
10
5
†
°C/W
ns/V
Unit
Unit
mW
mA
mA
mA
mA
mA
°C
°C
°C
°C
V
V
V
V
V
V
V