2SK2611 TOSHIBA Semiconductor CORPORATION, 2SK2611 Datasheet
2SK2611
Available stocks
Related parts for 2SK2611
2SK2611 Summary of contents
Page 1
... 150 ° −55~150 °C stg Symbol Max Unit R 0.833 ° (ch− ° (ch− Ω 2SK2611 1. GATE 2. DRAIN (HEAT SINK) 3. SOURCE JEDEC ― JEITA SC-65 TOSHIBA 2-16C1B Weight: 4.6 g (typ 2006-11-10 Unit: mm ...
Page 2
... Symbol Test Condition I — — DRP DSF 2SK2611 Min Typ. Max — — ±10 ±30 — — — — 100 900 — — 2.0 — 4.0 — 1.1 1.4 3.0 7.0 — — 2040 — ...
Page 3
... 3 2SK2611 2006-11-10 ...
Page 4
... 4 2SK2611 2006-11-10 ...
Page 5
... Ω 2SK2611 1 ⎛ B ⎞ VDSS ⋅ L ⋅ ⋅ ⎜ ⎟ − ⎝ ⎠ VDSS DD 2006-11-10 ...
Page 6
... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2SK2611 20070701-EN 2006-11-10 ...