BLM21AG601SN1

Manufacturer Part NumberBLM21AG601SN1
ManufacturerMurata
BLM21AG601SN1 datasheet
 


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Page 139/163

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!Note
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
!Note
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
EMIFILr (Soldering and Mounting)
Continued from the preceding page.
Series
oUse H60A solder for pattern printing.
NFW31S
NFE31P
oCoat the solder paste a thickness: 150-200 m
oUse H60A solder for pattern printing.
NFE61P
NFE61H
oCoat the solder paste a thickness: 150-200 m
oUse H60A solder for pattern printing.
DLP
DLW
oCoat the solder paste a thickness:
DLM
100-150 m: DLW21S/21H/31S/DLP11S
150-200 m: DLP31D/31S, DLM2HG, DLW5AH/5BS
DLP11S/31S
a
b
Series
DLP11S
DLP31S
DLP31D
0.4
6
0.8
DLW5AH/5BS
138
Solder Paste Printing
0.6
2.2
4.2
1.5
4.8
8.8
DLW21S/DLW21H/DLW31S
a
b
a
Series
a
b
c
d
a
b
0.7
0.55
0.3
0.55
DLW21S/H
0.8
2.6
0.5
1.0
0.6
0.7
2.1
DLW31S
1.6
3.7
0.4
DLM2HG
5.5
2.9
0.9
1.0
4.0
Adhesive Application
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
Bonding agent
Apply 1.0mg of bonding agent at each chip.
Bonding agent
Bonding agent
DLP31S/DLM2HG
Apply 0.3mg of bonding agent at each chip.
DLP31D
c
d
1.2
Coating Position of
Bonding Agent
1.6
Coating Position of
Bonding Agent
Continued on the following page.
C31E9.pdf 03.3.12
(in mm)
Coating positon of
bonding agent
1.5
4.8
9.0
DLP31S
Coating Position of
Bonding Agent
DLM2HG