HM-6508 Intersil Corporation, HM-6508 Datasheet - Page 3

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HM-6508

Manufacturer Part Number
HM-6508
Description
1024 X 1 Cmos Ram
Manufacturer
Intersil Corporation
Datasheet
Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . GND -0.3V to VCC +0.3V
Typical Derating Factor . . . . . . . . . . .1.5mA/MHz Increase in ICCOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range . . . . . . . . . . . . . . . . -55
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . .VCC -2.0V to VCC
Input Rise and Fall Time. . . . . . . . . . . . . . . . . . . . . . . . . . 40ns Max.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Device Guaranteed and 100% Tested
NOTES:
1.
1. All voltages referenced to device GND.
2. Typical derating 1.5mA/MHz increase in ICCOP.
Output Low Voltage
Output High Voltage
Input Leakage Current
Output Leakage Current
Data Retention Supply Current
Operating Supply Current
Standby Supply Current
HM-6508B/883
HM-6508/883
JA
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
TABLE 1. HM-6508/883 DC ELECTRICAL PERFORMANCE SPECIFICATIONS
SYMBOL
ICCDR
ICCOP
ICCSB
VOH
VOL
IOZ
II
VCC = 4.5V,
IOL = 3.2mA
VCC = 4.5V,
IOH = -0.4mA
VCC = 5.5V,
VI = GND or VCC
VCC = 5.5V,
VO = GND or VCC
VCC = 2.0V,
E = VCC,
IO = 0mA,
VI = VCC or GND
VCC = 5.5V,
(Note 2),
E = 1MHz,
IO = 0mA,
VCC = 5.0V,
IO = 0mA,
VI = VCC or GND
CONDITIONS
(NOTE 1)
o
C to +125
HM-6508/883
o
C
6-71
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Storage Temperature Range . . . . . . . . .-65
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +175
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1925 Gates
SUBGROUPS
GROUP A
CERDIP Package . . . . . . . . . . . . . . . .
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
-55
-55
-55
-55
-55
-55
-55
TEMPERATURE
o
o
o
o
o
o
o
C
C
C
C
C
C
C
T
T
T
T
T
T
T
A
A
A
A
A
A
A
+125
+125
+125
+125
+125
+125
+125
o
o
o
o
o
o
o
C
C
C
C
C
C
C
MIN
-1.0
-1.0
2.4
75
-
-
-
-
-
LIMITS
o
JA
C/W
MAX
+1.0
+1.0
0.4
10
10
5
4
-
o
C to +150
15
UNITS
o
JC
C/W
mA
V
V
A
A
A
A
A
o
o
o
C
C
C

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