CRG05 TOSHIBA Semiconductor CORPORATION, CRG05 Datasheet - Page 2

• Manufacturer Part Number: CRG05
• Description: Toshiba Rectifier Silicon Diffused Type
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Electrical Characteristics
Marking
Standard Soldering Pad
Handling Precaution
The absolute maximum ratings are rated values and must not be exceeded during operation, even for an instant. The
followings are the general derating methods that we recommend when you design a circuit with a device.
V
I
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore,
this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at Tj below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
F(AV)
RRM
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
: We recommend that the worst case current be no greater than 80% of the maximum rating of I
Abbreviation Code
: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum
rating of V
V
at low temperature.
adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an
allowable Ta max-I
RRM
G5
Characteristics
has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a device
1.2
RRM
for a DC circuit and be no greater than 50% of that of V
1.2
F(AV)
Part No.
CRG05
curve.
2.8
(Ta = 25°C)
Symbol
R
V
V
V
R
I
th (j-a)
FM(1)
FM(2)
FM(3)
RRM
th (j-ℓ)
I
I
I
V
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
Unit: mm
FM
FM
FM
RRM
= 0.1 A (Pulse test)
= 0.7 A (Pulse test)
= 1.0 A (Pulse test)
= 800 V (Pulse test)
―
2
Test Condition
RRM
for an AC circuit.
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.86
1.05
1.0
⎯
⎯
⎯
⎯
F(AV)
2008-02-01
Max
130
1.2
10
65
20
⎯
⎯
CRG05
. Carry out
°C/W
°C/W
Unit
μA
V
V
V