GP1200ESM33 Dynex Semiconductor, GP1200ESM33 Datasheet

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GP1200ESM33

Manufacturer Part Number
GP1200ESM33
Description
High Reliability Single Switch Igbt Module Advance Information
Manufacturer
Dynex Semiconductor
Datasheet
Replaces July 2000 version, DS5308-1.6
FEATURES
APPLICATIONS
and single switch configurations covering voltages from 1200V to
3300V and currents up to 4800A.
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) ensuring reliability in demanding applications. This
device is optimised for traction drives and other applications
requiring high thermal cycling capability or very high reliability.
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
GP1200ESM33
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
High Thermal Cycling Capability
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates
High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters
The Powerline range of high power modules includes dual
The GP1200ESM33 is a single switch 3300V, n channel
The module incorporates an electrically isolated base plate
High Reliability Single Switch IGBT Module
KEY PARAMETERS
V
V
I
I
C
C(PK)
CES
CE(sat)
Aux C
G
Aux E
Fig. 2 Electrical connections - (not to scale)
(See package details for further information)
Fig. 1 Single switch circuit diagram
(typ)
(max)
(max)
E1
C1
Outline type code: E
External connection
External connection
3300V
3.4V
1200A
2400A
Advance Information
GP1200ESM33
E2
C2
DS5308-2.1 February 2001
GP1200ESM33
C3
E3
1/9

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GP1200ESM33 Summary of contents

Page 1

... The Powerline range of high power modules includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A. The GP1200ESM33 is a single switch 3300V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications ...

Page 2

... GP1200ESM33 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. ...

Page 3

... 120mA 15V 1200A 15V 1200A 125˚ case 1ms 1200A 1200A 125˚C F case V = 25V 0V 1MHz GP1200ESM33 Min. Typ. Max. Units - - 100 5.5 4.5 6.5 V 3.4 - 4 1200 2400 A - 2.3 2.9 ...

Page 4

... GP1200ESM33 ELECTRICAL CHARACTERISTICS T = 25˚C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Diode reverse recovery charge rr I Diode reverse current rr E Diode reverse recovery energy ...

Page 5

... T 600 case V = ±15V ge 400 R g(OFF 200 3.0 3.5 - (V) F Fig.6 Reverse bias safe operating area GP1200ESM33 V = 20/15/12/10V ge = 125˚C 1.0 2.0 3.0 4.0 5.0 Collector-emitter voltage (V) ce Fig.4 Typical output characteristics = 125˚C = 3.3Ω = 660nF /dt < 9000V/µs 2500 500 1000 1500 2000 ...

Page 6

... GP1200ESM33 10000 I max. (single pulse) C 1000 100 10 Conditions 125˚ 80˚C vj case 100 Collector-emitter voltage, V Fig.7 Forward bias safe operating area 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 Case temperature, T Fig.9 DC current rating vs case temperature 6/9 Caution: This device is sensitive to electrostatic discharge ...

Page 7

... For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com Nominal weight: 1700g Module outline type code: E GP1200ESM33 7/9 ...

Page 8

... GP1200ESM33 ASSOCIATED PUBLICATIONS Title Electrostatic handling precautions An introduction to IGBTs IGBT ratings and characteristics Heatsink requirements for IGBT modules Calculating the junction temperature of power semiconductors Gate drive considerations to maximise IGBT efficiency Parallel operation of IGBTs – punch through vs non-punch through characteristics Guidance notes for formulating technical enquiries ...

Page 9

... Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5308-2 Issue No. 2.1 February 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM GP1200ESM33 9/9 ...

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