GP1600FSM18 Dynex Semiconductor, GP1600FSM18 Datasheet

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GP1600FSM18

Manufacturer Part Number
GP1600FSM18
Description
Hi-Reliability Single Switch IGBT Module
Manufacturer
Dynex Semiconductor
Datasheet
Replaces May 2000 version, DS5361-1.1
FEATURES
APPLICATIONS
and single switch configurations covering voltages from 1200V to
3300V and currents up to 4800A.
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) ensuring reliability in demanding applications. This
device is optimised for traction drives and other applications
requiring high thermal cycling capability or very high reliability.
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
ORDERING INFORMATION
Order As:
GP1600FSM18
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
High Thermal Cycling Capability
1600A Per Module
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates
High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters
The Powerline range of high power modules includes dual
The GP1600FSM18 is a single switch 1800V, n channel
The module incorporates an electrically isolated base plate
Hi-Reliability Single Switch IGBT Module
KEY PARAMETERS
V
V
I
I
C
C(PK)
CES
CE(sat)
Fig. 2 Electrical connections - (not to scale)
(See package details for further information)
Fig. 1 Single switch circuit diagram
(typ)
(max)
(max)
Aux C
G
Aux E
Aux C
Aux E
Outline type code: F
G
External connection
External connection
E1
C1
1800V
3.5V
1600A
3200A
E1
E2
GP1600FSM18
C1
C2
GP1600FSM18
DS5361-2.3 January 2001
E2
C2
1/9

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GP1600FSM18 Summary of contents

Page 1

... The Powerline range of high power modules includes dual and single switch configurations covering voltages from 1200V to 3300V and currents up to 4800A. The GP1600FSM18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications ...

Page 2

... GP1600FSM18 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. ...

Page 3

... 80mA 15V 1600A 15V 1600A 125˚ case 1ms 1600A 1600A 125˚C F case V = 25V 0V 1MHz GP1600FSM18 Min. Typ. Max. Units - - 5.5 4.5 6 1600 3200 A - 2.2 2.5 ...

Page 4

... GP1600FSM18 ELECTRICAL CHARACTERISTICS T = 25˚C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Diode reverse recovery charge rr I Diode reverse current rr E Diode reverse recovery energy ...

Page 5

... V I 1400 E 1200 OFF E ON 1000 E REC 800 600 400 200 0 0 1000 1200 1400 1600 - (A) C Fig. 6 Typical switching energy vs gate resistance GP1600FSM18 V = 20/15/12V ge = 125˚C 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 Collector-emitter voltage (V) ce Fig. 4 Typical output characteristics = 125˚C case = ±15V GE = 900V CE = 1600A ...

Page 6

... GP1600FSM18 3200 2800 T 2400 2000 1600 1200 800 400 0 0 0.5 1.0 1.5 2.0 Foward voltage, V Fig. 7 Diode typical forward characteristics 10000 I max. (single pulse) C 1000 100 100 Collector-emitter voltage, V Fig. 9 Forward bias safe operating area 6/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. ...

Page 7

... For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com Aux C Aux 14 140 Nominal weight: 1600g Module outline type code: F GP1600FSM18 6x Ø7 7/9 ...

Page 8

... GP1600FSM18 ASSOCIATED PUBLICATIONS Title Electrostatic handling precautions An introduction to IGBTs IGBT ratings and characteristics Heatsink requirements for IGBT modules Calculating the junction temperature of power semiconductors Gate drive considerations to maximise IGBT efficiency Parallel operation of IGBTs – punch through vs non-punch through characteristics Guidance notes for formulating technical enquiries ...

Page 9

... Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5261-2 Issue No. 2.2 January 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM GP1600FSM18 9/9 ...

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