GP1200FSM18 Dynex Semiconductor, GP1200FSM18 Datasheet

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GP1200FSM18

Manufacturer Part Number
GP1200FSM18
Description
Hi-reliability Single Switch Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
FEATURES
APPLICATIONS
and single switch configurations covering voltages from 600V to
3300V and currents up to 4800A.
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) ensuring reliability in demanding applications. This
device is optimised for traction drives and other applications
requiring high thermal cycling capability or very high reliability.
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise earthed heat sinks for safety.
ORDERING INFORMATION
Order As:
GP1200FSM18
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
High Thermal Cycling Capability
Non Punch Through Silicon
Isolated MMC Base with AlN Substrates
1200A Per Module
High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters
The Powerline range of high power modules includes dual
The GP1200FSM18 is a single switch 1800V, n channel
The module incorporates an electrically isolated base plate
Hi-Reliability Single Switch IGBT Module
KEY PARAMETERS
V
V
I
I
C
C(PK)
CES
CE(sat)
Fig. 2 Electrical connections - (not to scale)
(See package details for further information)
Fig. 1 Single switch circuit diagram
(typ)
(max)
(max)
Aux C
Aux C
G
Aux E
Aux E
G
Outline type code: F
External connection
External connection
E1
C1
E1
E2
1800V
3.5V
1200A
2400A
GP1200FSM18
C1
C2
GP1200FSM18
E2
DS5410-1.2 January 2001
C2
1/9

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GP1200FSM18 Summary of contents

Page 1

... The Powerline range of high power modules includes dual and single switch configurations covering voltages from 600V to 3300V and currents up to 4800A. The GP1200FSM18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications ...

Page 2

... GP1200FSM18 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. ...

Page 3

... 60mA 15V 1200A 15V 1200A 125˚ case 1ms 1200A 1200A 125˚C F case V = 25V 0V 1MHz GP1200FSM18 Min. Typ. Max. Units - - 5.5 4.5 6 1200 2400 A - 2.2 2.5 ...

Page 4

... GP1200FSM18 ELECTRICAL CHARACTERISTICS T = 25˚C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Diode reverse recovery charge rr I Diode reverse current rr E Diode reverse recovery energy ...

Page 5

... 1200A 50nH 1.50 1.25 1.00 E OFF E ON 0.75 E REC 0.50 0. 800 1000 1200 - (A) C Fig. 6 Typicalswitching energy vs gate resistance GP1200FSM18 V = 20/15/12V ge = 125˚C 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 Collector-emitter voltage (V) ce Fig. 4 Typical output characteristics = 125˚C = 15V = 900V E OFF Gate resistance, R ...

Page 6

... GP1200FSM18 2400 2200 2000 T 1800 1600 1400 1200 1000 800 600 400 200 0 0 2.0 0.5 1.0 1.5 Foward voltage, V Fig. 7 Diode typical forward characteristics 10000 1000 I (DC) C max 100 100 Collector emitter voltage, V Fig. 9 Forward bias safe operating area 6/9 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. ...

Page 7

... For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com Aux C Aux 14 140 Nominal weight: 1050g Module outline type code: F GP1200FSM18 6x Ø7 7/9 ...

Page 8

... GP1200FSM18 ASSOCIATED PUBLICATIONS Title Electrostatic handling precautions An introduction to IGBTs IGBT ratings and characteristics Heatsink requirements for IGBT modules Calculating the junction temperature of power semiconductors Gate drive considerations to maximise IGBT efficiency Parallel operation of IGBTs – punch through vs non-punch through characteristics Guidance notes for formulating technical enquiries ...

Page 9

... Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5410-1 Issue No. 1.2 January 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM GP1200FSM18 9/9 ...

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