MD16R1624DF0 Samsung Semiconductor, Inc., MD16R1624DF0 Datasheet - Page 13

• Manufacturer Part Number: MD16R1624DF0
• Description: Description = MD16R1624(8/G)DF0, MD18R1624(8/G)DF0 (16Mx16)*4(8/16)pcs RIMM(TM) Module Based on 256Mb D-die, 32s Banks,16K/32ms Ref, 2.5V ;; Density(MB) = 128 ;; Organization = 32Mx32 ;; Component Composition = 256M(5th)x4 ;; Voltage(V) = 2.5 ;; Refr
• Manufacturer: Samsung Semiconductor, Inc.

MD16R1624(8/G)DF0 - CN1 for 1200MHz
MD18R1624(8/G)DF0 - CN1 for 1200MHz
Physical Dimensions -1 ( For PCB )
The following defines the 2 channel RDRAM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
5.68[0.2236]
A-1
B-1
[0.006 0.004]
0.15 0.10
[0.031 0.004]
2.85[0.112]
0.80 0.10
Note : The gray area above represents the contact surface of the heat spreader.
DIA 2.44
R 2.00
R 2.00
Heat spreader
DIA 2.44
DETAIL A
Figure 3 : 32 bit RIMM Module PCB Physical Dimensions
1.00[0.039]
COMPONENT AREA
COMPONENT AREA
[0.12 0.002]
1.00 [0.039]
2.99 0.05
133.35 0.127[5.250 0.005]
(B SIDE)
(A SIDE)
Min.4.88
[0.192]
127.65[5.026]
Page 12
[0.118 0.004]
0.127[ 0.005].
3.00 0.10
Version 1.0 January 2003
DETAIL B
32 Bit RIMM
A-116
2.85[0.112]
B-116
[0.118 0.004]
3.00 0.10
®
8.60[0.339]
[0.157 0.006]
7.468[0.294]
4.00 0.15
Module