LM386N National Semiconductor, LM386N Datasheet - Page 2

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LM386N

Manufacturer Part Number
LM386N
Description
Low Voltage Audio Power Amplifier
Manufacturer
National Semiconductor
Datasheet

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Operating Supply Voltage (V
LM386N-1, -3, LM386M-1, LM386MM-1
LM386N-4
Quiescent Current (I
Output Power (P
LM386N-1, LM386M-1, LM386MM-1
LM386N-3
LM386N-4
Voltage Gain (A
Bandwidth (BW)
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
Input Resistance (R
Input Bias Current (I
T
Electrical Characteristics
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 3: For operation in ambient temperatures above 25˚C, the device must be derated based on a 150˚C maximum junction temperature and 1) a thermal resis-
tance of 107˚C/W junction to ambient for the dual-in-line package and 2) a thermal resistance of 170˚C/W for the small outline package.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Supply Voltage (LM386N-4)
Package Dissipation (Note 3)
Input Voltage
Storage Temperature
Operating Temperature
Junction Temperature
Soldering Information
A
(LM386N-1, -3, LM386M-1)
(LM386N)
(LM386M)
(LM386MM-1)
= 25˚C
Parameter
V
OUT
)
IN
Q
BIAS
)
)
)
)
S
)
(Notes 1, 2)
V
V
V
V
V
V
10 µF from Pin 1 to 8
V
V
f = 1 kHz, Pins 1 and 8 Open
V
Pins 1 and 8 Open, Referred to Output
−65˚C to +150˚C
S
S
S
S
S
S
S
S
S
= 6V, V
= 6V, R
= 9V, R
= 16V, R
= 6V, f = 1 kHz
= 6V, Pins 1 and 8 Open
= 6V, R
= 6V, f = 1 kHz, C
= 6V, Pins 2 and 3 Open
(Note 2)
0˚C to +70˚C
0.595W
+150˚C
1.25W
0.73W
IN
L
L
L
±
L
0.4V
= 8 , THD = 10%
= 8 , THD = 10%
= 8 , P
15V
22V
= 0
= 32 , THD = 10%
Conditions
2
OUT
BYPASS
Thermal Resistance
See AN-450 “Surface Mounting Methods and Their Effect
on Product Reliability” for other methods of soldering
surface mount devices.
= 125 mW
Dual-In-Line Package
Small Outline Package
JC
JA
JC
JA
JA
JC
Soldering (10 sec)
(SOIC and MSOP)
Vapor Phase (60 sec)
Infrared (15 sec)
= 10 µF
(DIP)
(DIP)
(SO Package)
(SO Package)
(MSOP)
(MSOP)
Min
250
500
700
4
5
1000
Typ
325
700
300
250
0.2
26
46
50
50
4
Max
12
18
8
107˚C/W
172˚C/W
210˚C/W
37˚C/W
35˚C/W
56˚C/W
+260˚C
+215˚C
+220˚C
Units
mW
mW
mW
kHz
mA
k
dB
dB
dB
nA
%
V
V

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