LM567

Manufacturer Part NumberLM567
DescriptionTone Decoder
ManufacturerNational Semiconductor
LM567 datasheet
 


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Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage Pin
Power Dissipation (Note 2)
V
8
V
3
V
3
Storage Temperature Range
Electrical Characteristics
= 25˚C, V
+
= 5V
AC Test Circuit, T
A
Parameters
Power Supply Voltage Range
Power Supply Current Quiescent
Power Supply Current Activated
Input Resistance
Smallest Detectable Input Voltage
Largest No Output Input Voltage
Largest Simultaneous Outband Signal to
Inband Signal Ratio
Minimum Input Signal to Wideband Noise
Ratio
Largest Detection Bandwidth
Largest Detection Bandwidth Skew
Largest Detection Bandwidth Variation
with Temperature
Largest Detection Bandwidth Variation
with Supply Voltage
Highest Center Frequency
Center Frequency Stability (4.75–5.75V)
Center Frequency Shift with Supply
Voltage
Fastest ON-OFF Cycling Rate
Output Leakage Current
Output Saturation Voltage
Output Fall Time
Output Rise Time
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guar-
antee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is
given, however, the typical value is a good indication of device performance.
Note 2: The maximum junction temperature of the LM567 and LM567C is 150˚C. For operating at elevated temperatures, devices in the TO-5 package must be de-
rated based on a thermal resistance of 150˚C/W, junction to ambient or 45˚C/W, junction to case. For the DIP the device must be derated based on a thermal resis-
tance of 110˚C/W, junction to ambient. For the Small Outline package, the device must be derated based on a thermal resistance of 160˚C/W, junction to ambient.
Note 3: Refer to RETS567X drawing for specifications of military LM567H version.
www.national.com
(Note 1)
Operating Temperature Range
LM567H
LM567CH, LM567CM, LM567CN
Soldering Information
Dual-In-Line Package
9V
Soldering (10 sec.)
1100 mW
Small Outline Package
15V
Vapor Phase (60 sec.)
−10V
Infrared (15 sec.)
V
+ 0.5V
4
See AN-450 “Surface Mounting Methods and Their Effect
−65˚C to +150˚C
on Product Reliability” for other methods of soldering
surface mount devices.
LM567
Conditions
Min
Typ
4.75
5.0
R
= 20k
6
L
R
= 20k
11
L
18
20
I
= 100 mA, f
= f
20
L
i
o
I
= 100 mA, f
= f
10
15
C
i
o
6
B
= 140 kHz
n
−6
12
14
1
±
0.1
4.75–6.75V
±
1
100
500
<
<
±
0
T
70
35
60
A
<
<
±
−55
T
+125
35
A
140
4.75V–6.75V
0.5
4.75V–9V
f
/20
o
V
= 15V
0.01
8
e
= 25 mV, I
= 30 mA
0.2
i
8
e
= 25 mV, I
= 100 mA
0.6
i
8
30
150
2
−55˚C to +125˚C
0˚C to +70˚C
260˚C
215˚C
220˚C
LM567C/LM567CM
Units
Max
Min
Typ
Max
9.0
4.75
5.0
9.0
V
8
7
10
mA
13
12
15
mA
15
20
k
25
20
25
mVrms
10
15
mVrms
6
dB
−6
dB
% of f
16
10
14
18
o
2
2
3
% of f
o
±
%/˚C
0.1
±
±
±
2
1
5
%V
100
500
kHz
±
35
60
ppm/˚C
±
35
ppm/˚C
140
1.0
0.4
2.0
%/V
2.0
2.0
%/V
f
/20
o
25
0.01
25
µA
0.4
0.2
0.4
V
1.0
0.6
1.0
30
ns
150
ns