MAX6900 Maxim, MAX6900 Datasheet - Page 17

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MAX6900

Manufacturer Part Number
MAX6900
Description
I2C-Compatible RTC in a TDFN
Manufacturer
Maxim
Datasheet

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(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17
© 2003 Maxim Integrated Products
PACKAGE VARIATIONS
PKG. CODE
T633-1
T833-1
T1033-1
SYMBOL
COMMON DIMENSIONS
A
A1
A2
D
E
L
k
10
N
MIN.
6
8
0.70
2.90
2.90
0.00
0.20
0.25 MIN.
0.20 REF.
1.50–0.10
1.50–0.10
1.50–0.10
MAX.
D2
0.80
3.10
3.10
0.05
0.40
Printed USA
2.30–0.10
2.30–0.10
2.30–0.10
E2
I
2
C-Compatible RTC in a TDFN
0.65 BSC
0.50 BSC
0.95 BSC
e
MO229 / WEED-3
MO229 / WEEC
MO229 / WEEA
JEDEC SPEC
Package Information (continued)
is a registered trademark of Maxim Integrated Products.
0.40–0.05
0.30–0.05
0.25–0.05
b
[(N/2)-1] x e
1.95 REF
2.00 REF
1.90 REF
TITLE:
APPROVAL
PROPRIETARY INFORMATION
TDFN, EXPOSED PAD, 3x3x0.80 mm
PACKAGE OUTLINE, 6, 8 & 10L,
SEMICONDUCTOR
DALLAS
DOCUMENT CONTROL NO.
21-0137
REV.
D
2
2

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