HSMG-C260 Hewlett-Packard, HSMG-C260 Datasheet - Page 8

• Manufacturer Part Number: HSMG-C260
• Description: (HSMx-C260) Surface Mount Chip LEDs
• Manufacturer: Hewlett-Packard

Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
Figure 11. Tape Leader and Trailer Dimensions.
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
0.1 mm ( 0.004 in.) unless otherwise specified.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
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Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-0366EN
April 15, 2002
5988-6269EN