BSP75 Siemens (acquired by Infineon Technologies Corporation), BSP75 Datasheet
BSP75
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BSP75 Summary of contents
Page 1
Smart Lowside Power Switch Features Logic Level Input Input protection (ESD) Thermal shutdown (with restart) Overload protection Short circuit protection Overvoltage protection Current limitation Application All kinds of resistive, inductive and capacitive loads in switching applications C compatible power switch ...
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Maximum Ratings =25°C unless otherwise specified Parameter Continuous drain source voltage (overvoltage protection see page 4) Drain source voltage for short circuit protection Load dump protection V LoadDump =400ms; IN=low or ...
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Electrical Characteristics Parameter and Conditions °C, unless otherwise specified j Static Characteristics Drain source clamp voltage Off state drain current Input ...
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Parameter and Conditions °C, unless otherwise specified j Protection Functions Thermal overload trip temperature Thermal hysteresis Unclamped single pulse inductive energy I =0 =32 V D(ISO) bb Inverse Diode Continuous source drain voltage V ...
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Block diagram Terms HITFET V IN Input circuit (ESD protection) IN ESD-ZD I Source ESD zener diodes are not designed for DC current. Semiconductor Group Inductive and overvoltage output clamp ...
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Maximum allowable power dissipation tot C P [W] tot 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0 On-state resistance ...
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Typ. on-state resistance 0 25° 000 1 500 1 000 500 Typ. short circuit current I = ...
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Application examples: Status signal of thermal shutdown by monitoring input current HITFET µC µ Semiconductor Group thermal shutdown Page 8 HITFET ® BSP 75 1998-02-04 ...
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... Package and ordering code all dimensions in mm SOT223/4 BSP75 Definition of soldering point with temperature T upper side of solder edge of device pin 4. Pin 4 Semiconductor Group Ordering code Q67060-S7200- Page 9 HITFET ® BSP 75 1998-02-04 ...