IRF7751GPBF International Rectifier, IRF7751GPBF Datasheet

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IRF7751GPBF

Manufacturer Part Number
IRF7751GPBF
Description
Power MOSFET
Manufacturer
International Rectifier
Datasheet
www.DataSheet.in
Description
l
l
l
l
l
l
l
HEXFET
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
signer with an extremely efficient and reliable device
for use in battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
V
I
I
I
P
P
V
T
R
D
D
DM
J,
DS
D
D
GS
θJA
@ T
@ T
Ultra Low On-Resistance
Dual P-Channel MOSFET
Very Small SOIC Package
Low Profile (< 1.2mm)
Available in Tape & Reel
Lead-Free
Halogen-Free
@T
@T
T
STG
A
A
A
A
®
= 25°C
= 70°C
= 25°C
= 70°C
power MOSFETs from International Rectifier
Drain-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Parameter
Parameter
provides the de-
ƒ
ƒ
GS
GS
ƒ
@ -10V
@ -10V
!
"
!Ã2ÃT
"Ã2ÃT
V
-30V
Ã2Ã9
Ã2ÃB
DSS
IRF7751GPbF
HEXFET
55mΩ@V
35mΩ@V
'Ã2Ã9!
&Ã2ÃT!
%Ã2ÃT!
$Ã2ÃB!
-55 to +150
R
Max.
'
&
%
$
Max.
0.008
125
DS(on)
0.64
-4.5
-3.6
-30
-18
±20
1.0
®
GS
GS
Power MOSFET
max
= -4.5V
= -10V
TSSOP-8
PD - 96145A
-4.5A
-3.8A
Units
Units
I
W/°C
°C/W
D
05/14/09
°C
V
A
V
1

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IRF7751GPBF Summary of contents

Page 1

... GS Pulsed Drain Current  ƒ Power Dissipation ƒ Power Dissipation Linear Derating Factor Gate-to-Source Voltage Junction and Storage Temperature Range Parameter ƒ Maximum Junction-to-Ambient PD - 96145A IRF7751GPbF ® HEXFET Power MOSFET V R max DSS DS(on) -30V 35mΩ@V = -10V -4.5A GS 55mΩ@ ...

Page 2

Electrical Characteristics @ T V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I ...

Page 3

DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 T = 150 0.1 2 Fig 3. Typical Transfer Characteristics www.irf.com www.DataSheet.in VGS TOP -10.0V -7.0V ...

Page 4

C iss 2400 1600 800 C oss C rss Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 100 T = 150 0.1 0.2 0 Fig 7. Typical Source-Drain Diode ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 1 0.1 0.00001 Fig 11. Maximum ...

Page 6

GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs Fig 14a. Basic Gate Charge Waveform 6 www.DataSheet. -4.5A 5.0 6.0 7.0 8.0 9.0 ...

Page 7

TSSOP8 Package Outline Dimensions are shown in milimeters (inches @! DI9@Y 6SF r "Y r! 'YÃi 8 iii hhh 8 'ÃTVSA 9D@ T " Note: For the most current drawing ...

Page 8

G@) GPUÃ8P9@ TSSOP-8 Tape and Reel Information IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 8 www.DataSheet.in UCDTÃDTÃ6IÃDSA''$! 7A 6SUÃIVH7@S 96U@Ã8P9@Ã`XX  Ã2ÃGrhqA…rrÃvqvph‡‚… %À€ A@@9Ã9DS@8UDPI IPU@T) 'À€ ÃÃU6Q@ÃÉÃS@@GÃPVUGDI@Ã8PIAPSHTÃUPÃ@D6#' ÃÉÃ@D6$#  Data and specifications ...

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