BUK483-60A Philips Semiconductors, BUK483-60A Datasheet

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BUK483-60A

Manufacturer Part Number
BUK483-60A
Description
PowerMOS transistor
Manufacturer
Philips Semiconductors
Datasheet
Philips Semiconductors
GENERAL DESCRIPTION
N-channel enhancement mode
field-effect power transistor in a
plastic envelope suitable for surface
mount applications.
The device is intended for use in
automotive and general purpose
switching applications.
PINNING - SOT223
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
THERMAL RESISTANCES
1 Temperature measured at solder joint on drain tab.
September 1995
PowerMOS transistor
SYMBOL
V
V
I
I
I
P
T
T
SYMBOL PARAMETER
R
R
D
D
DM
PIN
V
stg
j
DS
DGR
tot
th j-sp
th j-amb
1
2
3
4
GS
gate
drain
source
drain (tab)
From junction to solder point
From junction to ambient
DESCRIPTION
PARAMETER
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage temperature
Junction temperature
QUICK REFERENCE DATA
PIN CONFIGURATION
SYMBOL
V
I
P
T
R
1
D
DS
tot
j
DS(ON)
CONDITIONS
Mounted on any PCB
Mounted on PCB of fig.18
CONDITIONS
R
T
T
-
-
T
T
-
-
amb
amb
amb
amb
1
GS
PARAMETER
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance;
= 20 k
= 25 ˚C
= 100 ˚C
= 25 ˚C
= 25 ˚C
1
2
4
3
V
GS
= 10 V
MIN.
SYMBOL
- 55
-
-
-
-
-
-
-
-
MIN.
-
-
g
TYP.
Product specification
MAX.
0.10
MAX.
150
12
3.2
1.8
60
150
150
3.2
2.0
1.8
-
60
60
30
13
BUK483-60A
d
s
MAX.
15
70
Rev 1.200
UNIT
UNIT
˚C
˚C
W
V
V
V
A
A
A
UNIT
˚C
K/W
K/W
W
V
A

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BUK483-60A Summary of contents

Page 1

... CONDITIONS - ˚C amb T = 100 ˚C amb ˚C amb ˚C amb - - CONDITIONS 1 Mounted on any PCB Mounted on PCB of fig.18 1 Product specification BUK483-60A MAX. UNIT 60 3.2 1.8 W 150 ˚C 0. SYMBOL MIN. MAX. UNIT - 3 ...

Page 2

... CONDITIONS - - 3.2 A; -dI /dt = 100 - CONDITIONS ˚C amb 2 Product specification BUK483-60A MIN. TYP. MAX. UNIT 2.1 3.0 4 0.1 1 100 nA - 0.07 0.10 MIN. TYP. MAX. UNIT - 6.0 - ...

Page 3

... Fig.5. Typical output characteristics BUKX83 1E+01 1E+03 Fig.6. Typical on-state resistance Product specification BUK483-60A BUK483-60A 100 100 0 0 100 VDS / ˚C amb = f single pulse; parameter t ...

Page 4

... f 10000 1000 100 10 80 100 120 140 Fig.12. Typical capacitances f Product specification BUK483-60A VGS(TO max. typ. min. -40 - 100 120 140 Fig.10. Gate threshold voltage. = f(T ); conditions mA ...

Page 5

... Fig.15. Normalised avalanche energy rating. DS VGS 0 1.5 Fig.16. Avalanche energy test circuit Product specification BUK483-60A WDSS% Normalised Avalanche Energy 100 120 Tamb f(T ); conditions 3.2 A DSS amb VDS - T.U. RGS ...

Page 6

... Fig.17. soldering pattern for surface mounting SOT223. September 1995 PRINTED CIRCUIT BOARD Dimensions in mm. 60 6.3 Fig.18. PCB for thermal resistance and power rating PCB: FR4 epoxy glass (1.6 mm thick), copper 6 Product specification BUK483-60A Dimensions in mm 4.5 4 for SOT223. laminate (35 m thick). ...

Page 7

... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to surface mounting instructions for SOT223 envelope. 3. Epoxy meets UL94 V0 at 1/8". September 1995 6.7 6.3 3.1 0.32 0.24 2.9 0.10 0. max 1.05 2.3 1.8 max 0.85 4.6 Fig.19. SOT223 surface mounting package. 7 Product specification BUK483-60A B 0 3.7 7.3 6.7 3 0.80 M 0.1 B 0.60 (4x) Rev 1.200 M A ...

Page 8

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1995 8 Product specification BUK483-60A Rev 1.200 ...

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