SC16C2550 Philips Semiconductors, SC16C2550 Datasheet - Page 44

• Manufacturer Part Number: SC16C2550
• Description: Dual UART with 16 bytes of transmit and receive FIFOs and infrared (IrDA) encoder/decoder
• Manufacturer: Philips Semiconductors

Philips Semiconductors
13. Revision history
Table 28:
9397 750 11621
Product data
Rev Date
03
02
01
20030619
20030314
20020904
Revision history
CPCN
-
-
-
12.4 Package related soldering information
Table 27:
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Mounting
Through-hole
mount
Surface mount
Description
Product data (9397 750 11621). ECN 853-2368 30033 of 16 June 2003.
Modifications:
Product data (9397 750 11204). ECN 853-2368 29624 of 07 March 2003.
Product data (9397 750 08831). ECN 853-2368 28865 of 04 September 2002.
•
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Figure 5 “Crystal oscillator connection.” on page
added connection with resistor.
Suitability of IC packages for wave, reflow and dipping soldering methods
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
Package
DBS, DIP, HDIP, SDIP, SIL suitable
BGA, LBGA, LFBGA,
SQFP, SSOP-T
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
Rev. 03 — 19 June 2003
[6]
, SO, SOJ
[1]
[4]
,
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
10 C measured in the atmosphere of the reflow
13: changed capacitors’ values and
[3]
[5]
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[6][7]
[8]
SC16C2550
Reflow
suitable
suitable
suitable
suitable
suitable
encoder/decoder
[2]
Dipping
suitable
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