ltc4007eufd-1-trpbf Linear Technology Corporation, ltc4007eufd-1-trpbf Datasheet - Page 19

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ltc4007eufd-1-trpbf

Manufacturer Part Number
ltc4007eufd-1-trpbf
Description
4a, High Efficiency, Standalone Li-ion Battery Charger
Manufacturer
Linear Technology Corporation
Datasheet
APPLICATIO S I FOR ATIO
Disabling the Thermistor Function
If the thermistor is not needed, connecting a resistor
between DCIN and NTC will disable it. The resistor should
be sized to provide at least 10µA with the minimum voltage
applied to DCIN and 10V at NTC. Do not exceed 30µA.
Generally, a 301k resistor will work for DCIN less than 15V.
A 499k resistor is recommended for DCIN between 15V
and 24V.
Conditioning Depleted Batteries
Severely depleted batteries, with less than 2.5V/cell, should
be conditioned with a trickle charge to prevent possible
damage. This trickle charge is typically 10% of the 1C rate
of the battery. The LTC4007 can automatically trickle
charge depleted batteries using the circuit in Figure 11. If
the battery voltage is less than 2.5V/cell (2.44V/cell if
CHEM is low) then the LOBAT indicator will be low and Q4
is off. This programs the charging current with R
+ R14. Charging current is approximately 300mA. When
the cell voltage becomes greater than 2.5V the LOBAT
indicator goes high, Q4 shorts out R13, then R
Charging current is then equal to 3A.
PCB Layout Considerations
For maximum efficiency, the switch node rise and fall
times should be minimized. To prevent magnetic and
electrical field radiation and high frequency resonant
problems, proper layout of the components connected to
the IC is essential (see Figure 12). Here is a PCB layout
priority list for proper layout. Layout the PCB using this
specific order.
U
U
W
PROG
U
PROG
= R6.
= R6
1. Input capacitors need to be placed as close as possible
2. The control IC needs to be close to the switching FET’s
3. Place inductor input as close as possible to switching
4. Place the output current sense resistor right next to
5. Place output capacitors next to the sense resistor
6. Output capacitor ground connections need to feed
to switching FET’s supply and ground connections.
Shortest copper trace connections possible. These
parts must be on the same layer of copper. Vias must
not be used to make this connection.
gate terminals. Keep the gate drive signals short for a
clean FET drive. This includes IC supply pins that con-
nect to the switching FET source pins. The IC can be
placed on the opposite side of the PCB relative to above.
FET’s output connection. Minimize the surface area of
this trace. Make the trace width the minimum amount
needed to support current—no copper fills or pours.
Avoid running the connection using multiple layers in
parallel. Minimize capacitance from this node to any
other trace or plane.
the inductor output but oriented such that the IC’s
current sense feedback traces going to resistor are not
long. The feedback traces need to be routed together
as a single pair on the same layer at any given time with
smallest trace spacing possible. Locate any filter
component on these traces next to the IC and not at the
sense resistor location.
output and ground.
into same copper that connects to the input capacitor
ground before tying back into system ground.
LTC4007
19
4007fa

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