lan91f Osram Opto Semiconductors, lan91f Datasheet - Page 11

• Manufacturer Part Number: lan91f
• Description: Chipled With Lens
• Manufacturer: Osram Opto Semiconductors

Empfohlenes Lötpaddesign
Recommended Solder Pad
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
2009-10-20
T
300
250
200
150
100
50
˚C
0
0
255 ˚C
240 ˚C
217 ˚C
25 ˚C
Ramp Up
3 K/s (max)
1.5 (0.059)
8) 9)
50
8) 9) Seite 15
120 s max
100
Recommended Solder Profile
2.0 (0.079)
Maximum Solder Profile
Minimum Solder Profile
11
150
Reflow Löten
Reflow Soldering
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020B)
(acc. to J-STD-020B)
200
100 s max
1.5 (0.059)
30 s max
Ramp Down
6 K/s (max)
10 s min
t
250
OHAPY608
260 ˚C
245 ˚C
235 ˚C
OHLA0687
s
+0 ˚C
-5 ˚C
+5 ˚C
-0 ˚C
±5 ˚C
300
LA N91F