hsdl3602 Avago Technologies, hsdl3602 Datasheet - Page 14

• Manufacturer Part Number: hsdl3602
• Description: Agilent Hsdl-3602 Irda Data 1.4 Compliant 4 Mb/s 3v Infrared Transceiver
• Manufacturer: Avago Technologies

2.0. Recommended solder paste/
cream volume for castellation joints
Based on calculation and experi-
ment, the printed solder paste
volume required per castellation
pad is 0.30 cubic mm (based on
either no-clean or aqueous solder
cream types with typically 60 to
65% solid content by volume).
See Figure 4
t, nominal stencil thickness
mm
0.152
0.127
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimension.
Figure 4. Solder paste stencil aperture.
3.0. Pick and Place Misalignment
Tolerance and Product Self-Align-
ment after Solder Reflow
If the printed solder paste volume
is adequate, the unit will self-
align in the X-direction after sol-
der reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the recom-
mended reflow profile. The di-
rection of board travel does not
matter.
14
l
SOLDER
PASTE
inches
0.006
0.005
l, length of aperture
mm
2.8 0.05
3.4 0.05
2.1. Recommended Metal Solder
Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure ad-
equate printed solder paste vol-
ume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
Allowable Misalignment Tolerance
X-direction
Theta-direction
APERTURE AS PER
LAND
w
t (STENCIL THICKNESS)
inches
0.110 0.002
0.134 0.002
2 degrees
0.2 mm (0.008 inches)