tb7101af TOSHIBA Semiconductor CORPORATION, tb7101af Datasheet - Page 4

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tb7101af

Manufacturer Part Number
tb7101af
Description
Buck Dc-dc Converter Ic
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
Absolute Maximum Ratings
Thermal Resistance Characteristic
Input voltage
Enable pin voltage
V
Feedback pin voltage
Switch pin voltage
Switch pin current
Power dissipation
Operating junction temperature
Junction temperature
Storage temperature
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
Thermal resistance, junction and ambient
Note 1:
Note 2: The TB7101AF may go into thermal shutdown at the rated maximum junction temperature. Thermal design is
EN
−V
IN
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc)
voltage difference
required to ensure that the rated maximum operating junction temperature, T
Characteristics
Characteristics
Glass epoxy board
TB7101AF(T5L1.2,F)/(T5L1.5,F)/(T5L1.8,F)/(T5L2.5,F)/(T5L3.3,F)
(Note 1)
(Note 2)
Material: FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(Ta = 25°C)
V
Symbol
EN
T
V
V
V
T
V
I
P
LX
jopr
T
EN
FB
stg
LX
IN
− V
D
R
Symbol
j
th
IN
(j-a)
V
EN
−40 to 125
−55 to 150
−0.3 to 6
−0.3 to 6
−0.3 to 6
−0.3 to 6
Rating
− V
178.6 (Note 1)
±1.3
150
0.7
4
IN
Max
< 0.3
Unit
°C
°C
°C
W
V
V
V
V
V
A
°C/W
Unit
jopr
, will not be exceeded.
2008-05-22

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