s71gl128pc0 Meet Spansion Inc., s71gl128pc0 Datasheet - Page 8

• Manufacturer Part Number: s71gl128pc0
• Description: S71gl-p Based Mcps Stacked Multi-chip Product Mcp Flash Memory And Ram 128 Megabit 8 M X 16-bit Cmos 3.0 Volt-only Page Mode Flash Memory And 64 Megabit 4m X 16-bit Pseudo Static Ram
• Manufacturer: Meet Spansion Inc.

6. Physical Dimensions
6.1
8
TSB084—84-ball Fine-Pitch Ball Grid Array (FBGA) 11.6 x 8 mm Package
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
MD
ME
A1
A2
D1
E1
eE
eD
φb
D
CORNER
A
E
n
0.15 C
(2X)
PIN A1
A2
A1
H1,H10,J1,J10,K1,K10,L1,L10
M2,M3,M4,M5,M6,M7,M8,M9
MIN
0.17
0.81
0.35
A2,A3,A4,A5,A6,A7,A8,A9
---
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
84X
11.60 mm x 8.00 mm
INDEX MARK
0.15
0.08
11.60 BSC.
PACKAGE
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC
0.80 BSC
0.40 BSC
TSB 084
10
6
b
NOM
0.40
N/A
M C
M C
12
10
84
---
---
---
D a t a
A B
MAX
1.20
0.97
0.45
SIDE VIEW
TOP VIEW
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
S71GL-P Based MCPs
NOTE
( A d v a n c e
C
A
0.15
(2X)
E
B
C
0.20
0.08
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
I n f o r m a t i o n )
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
J
7
BOTTOM VIEW
H
S71GL-P_00_03 February 3, 2009
G
D1
F
E
D
C
B
A
3439 \ 16-038.22 \ 01.04.05
SE
CORNER
PIN A1
7
E1